The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection…
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
The compact system footprint and streamlined integration may help automakers adapt to shifting radio policies.
The compact system footprint and streamlined integration may help automakers adapt to shifting radio policies.
The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.
The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
The company's new, first-of-its-kind test software platform leverages AI to replace lengthy custom hardware or FPGA development.
The company's new, first-of-its-kind test software platform leverages AI to replace lengthy custom hardware or FPGA development.
The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale…
The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.
The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of…
The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on…
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide…
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.
In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional…
In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector…
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering…
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion…
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited…
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.
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