All About Circuits

Latest AI/Neural Networks News

Categories

xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

Announced today, the company's new PiezoMEMS air movers reach subsystems that conventional fans and cold plates can’t.


News 17 hours ago by Jake Hertz
Efinix Buckles Down on 64-bit RISC-V Performance for Embedded FPGA Designs

Efinix Buckles Down on 64-bit RISC-V Performance for Embedded FPGA Designs

Efinix expands its Sapphire RISC-V SoC family with a configurable 64-bit processor offering larger memory support, Linux capability and FPGA acceleration for embedded and edge AI designs.


News Oct 19, 2026 by Joshua Tidwell
TI Unveils New ADC and Power ICs to Slash AI Data Center Downtime

TI Unveils New ADC and Power ICs to Slash AI Data Center Downtime

This week, at the OCP Summit, Texas Instruments unveiled three new ICs designed to prevent power glitches, streamline high-voltage distribution, and minimize signal jitter in AI data centers.


News Oct 16, 2026 by Jeff Child
Agentic AI Takes the Stage at OCP Global Summit 2026

Agentic AI Takes the Stage at OCP Global Summit 2026

Intel, AMD, and Arm each made agentic AI announcements this week at OCP 2026, covering rack processor units, rack architecture, and benchmarking


News Oct 15, 2026 by Duane Benson
Summit 2026 Keynote - Betting Against the Bandgap: Reinventing Silicon Power Devices

Summit 2026 Keynote - Betting Against the Bandgap: Reinventing Silicon Power Devices

iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in power electronics and leverage silicon's infrastructure lead.


News Oct 14, 2026 by Dale Wilson
AMD Launches Ross, an Agentic AI Assistant for Embedded Design

AMD Launches Ross, an Agentic AI Assistant for Embedded Design

Ross connects developers' preferred LLMs to AMD's Vivado and Vitis HLS toolchains through open-standard MCP servers.


News Oct 13, 2026 by Luke James
Singular Photonics Launches First SPAD Sensor With In-Pixel Processing

Singular Photonics Launches First SPAD Sensor With In-Pixel Processing

The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.


News Oct 13, 2026 by Luke James
Ambarella Debuts Standalone AI Accelerator for Physical AI Designs

Ambarella Debuts Standalone AI Accelerator for Physical AI Designs

The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of the company’s AI SoCs.


News Oct 12, 2026 by Luke James
Cisco Unveils ICs for AI Fabrics and Nvidia-Codeveloped USFP Optics Spec

Cisco Unveils ICs for AI Fabrics and Nvidia-Codeveloped USFP Optics Spec

Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon One ASICs and runtime security to scale next-generation Ethernet AI fabrics.


News Oct 12, 2026 by Jeff Child
OmniOn Debuts High-Power DC-DC Bus Converters for AI Data Centers

OmniOn Debuts High-Power DC-DC Bus Converters for AI Data Centers

The new QODN non-isolated Osprey bus converters offer high efficiency and compact footprints for demanding AI data center and high-density compute applications.


News Oct 11, 2026 by Jeff Child
Omnivision Unveils AI Companion Processor for Always-On Parking Surveillance

Omnivision Unveils AI Companion Processor for Always-On Parking Surveillance

The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.


News Oct 09, 2026 by Jake Hertz
STMicro Unwraps Context-Aware Sensors Built With Sustainable Materials

STMicro Unwraps Context-Aware Sensors Built With Sustainable Materials

The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.


News Oct 08, 2026 by Luke James
Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficiency targets.


News Oct 07, 2026 by Dale Wilson
Summit 2026 - From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure

Summit 2026 - From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure

From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure


News Oct 07, 2026 by Tektronix
Summit 2026 - The Evolution of SiC Power Devices: Why Cascode and Dual Drive JFETs Matter

Summit 2026 - The Evolution of SiC Power Devices: Why Cascode and Dual Drive JFETs Matter

Discover how a new generation of normally-off SiC JFETs is emerging as a compelling alternative to mainstream SiC MOSFETs, driving new levels of efficiency, power density, and reliability.


Summit 2026 - Achieving 80 PLUS Certification: Precision Efficiency Testing for Server PSUs

Summit 2026 - Achieving 80 PLUS Certification: Precision Efficiency Testing for Server PSUs

Discover how precision power analyzers enable accurate efficiency measurements for data server power supplies and help meet 80 PLUS certification requirements under challenging load conditions.


News Oct 07, 2026 by Rohde & Schwarz
Summit 2026 - The Hidden Tech Powering AI: Advanced Magnetics for Next-Gen Data Centers

Summit 2026 - The Hidden Tech Powering AI: Advanced Magnetics for Next-Gen Data Centers

As AI power demands grow, advanced magnetics, protection, and power management technologies are enabling more efficient, reliable, and scalable data center architectures.


Summit 2026 - Optimizing Power Supply Units for Next Gen AI Data Centers

Summit 2026 - Optimizing Power Supply Units for Next Gen AI Data Centers

Explore emerging rack architectures and cutting-edge power supply unit (PSU) topologies with Infineon Technologies. Learn how Silicon, GaN, and SiC reference designs enable highly efficient, scalable systems.


Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.


News Oct 07, 2026 by Dale Wilson
Rambus Gets to the Root of SoC Security With Caliptra Support

Rambus Gets to the Root of SoC Security With Caliptra Support

Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and lifecycle management for data center and AI chips.


News Oct 06, 2026 by Joshua Tidwell