5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in…
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering…
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion…
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited…
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.
OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference,…
OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.
Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts…
Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.
Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable…
Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor,…
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.
The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language…
The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut…
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing…
Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
A new prototype tracks pulse transit time at four points on the body using millimeter-wave chirps and neural networks,…
A new prototype tracks pulse transit time at four points on the body using millimeter-wave chirps and neural networks, pointing toward ambient at-home heart monitoring.
The new SDG8000A series delivers functionality for DC-to-5-GHz signal synthesis for advanced RF and high-speed digital…
The new SDG8000A series delivers functionality for DC-to-5-GHz signal synthesis for advanced RF and high-speed digital applications.
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