By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD…
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD compatibility for industrial and robotic networks.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
This set of PMBus-compatible output modules and an accompanying digital development kit streamline the control,…
This set of PMBus-compatible output modules and an accompanying digital development kit streamline the control, monitoring, and integration of high-density configurable power supplies.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs…
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate…
Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited…
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor,…
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive…
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh…
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and…
The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto…
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.
Announced today, the new MCUs future-proof industrial and data center systems in anticipation for the post-quantum world.
Announced today, the new MCUs future-proof industrial and data center systems in anticipation for the post-quantum world.
The dsPIC33A digital signal controllers can deliver smarter power conversion and real-time control in server power…
The dsPIC33A digital signal controllers can deliver smarter power conversion and real-time control in server power supplies, DC-DC converters, energy storage, and robotics.
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