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Toshiba Debuts “Thermoflagger” as Temperature Sensor IC Alternative

The new solution helps to control the temperature rise in electronic equipment.

May 19, 2023 by Jake Hertz

Research Efforts Signal Next Steps for Quantum Processor Evolution

A trio of research papers offers new ideas that may solve some of the biggest hurdles to quantum processing technology.

January 14, 2023 by Kristijan Nelkovski

How One Startup’s Cooling Chip May Surge Processor Power

Seeing a disconnect between modern processors and outdated coolers, Frore Systems designed a thermal management solution to let chips run to their true potential.

December 07, 2022 by Aaron Carman

Aimed at Power Distribution, Menlo Micro Debuts “Highest” Power MEMS Switch

Putting its Ideal Switch technology back into action, Menlo Micro has unveiled what it says is the industry highest power MEMS switch device.

December 01, 2022 by Jeff Child

Our Electronica Interview with Infineon PSS Division President Adam White

In Infineon’s booth in the vast Hall C3 at Electronica 2022, we caught up with Adam White to talk supply chain, sustainability, green energy, and more.

November 23, 2022 by Jeff Child

Battery Storage Schemes Employ Freeze-Thaw Approach and More

Offering novel approaches to battery energy storage, a trio of research efforts are using electronic technologies and materials science to tackle energy storage challenges.

October 22, 2022 by Nicholas St. John

Samsung Employs its V-NAND Tech for Gaming NVMe SSD

Designed for gaming and creative applications, Samsung’s new SSD leverages its latest V-NAND technology.

August 26, 2022 by Jake Hertz

Rambus Spins DDR5 DIMM Interface ICs for Data Center Servers

Adding SPD (serial presence detect) hub and temperature sensor ICs to its DDR5 portfolio, Rambus now has a complete chipset offering for DDR5 DIMM interfacing.

July 19, 2022 by Jeff Child

Intel Beats the Data Center Heat With Open IP Immersion Liquid Cooling

Intel is aiming at a more sustainable data center with new investments and the industry’s first immersion cooling reference design.

May 24, 2022 by Jake Hertz

AMD SOM Kit Propels Robotics Beyond Custom Designs

Keen to free industrial robotics from the burdens of custom design, AMD has launched a SOM-based starter kit that puts ROS 2 and predefined interface apps into play.

May 17, 2022 by Jeff Child

Nix the Heat Sink: New GaN ICs Aim to Slim Down Power Supply Design

Yesterday, Power Integrations released a new family of flyback controller ICs which leverage GaN technology for maximize efficiency. Could this help push GaN further mainstream?

May 25, 2021 by Jake Hertz

Learning From the Past: EV High Power Density Trends

With EVs being a hot topic recently, what trending designs were used in the past could be learned from? Oak Ridge National Laboratory aims to do just that through its benchmarking project.

May 20, 2021 by Dr. Steve Arar

Microsoft Brings the Sea to Servers With Two-phase Immersion Cooling

Microsoft has announced that it will be the first cloud provider to implement two-phase liquid immersion cooling in a production environment.

April 12, 2021 by Jake Hertz

Companies Get Creative to Beat the Heat in Computing Applications

Here's a sweep of a few thermal management techniques across the industry—specifically aimed to keep computing applications cool.

April 03, 2021 by Nicholas St. John

Deconstructing Xiaomi’s Mi 11 Ultra—and the Consumer Tech Claims Surrounding It

Xiaomi claims the Mi 11 Ultra is the "world’s best photography smartphone." With few technical specs published, how do designers approach such claims?

April 02, 2021 by Jake Hertz

As EVs Heat Up, Can Thermal Management Systems Cool Them Down?

Managing heat in EVs is no simple task. With materials research and heat-resistant power electronics, however, thermal management systems are slowly advancing EV adoption.

March 24, 2021 by Nicholas St. John

Keeping Wearables Cool: Non-metallic Material Radiates Heat From Users, Circuitry, and the Sun

Thermal design is especially delicate in wearable devices. Here are a few ways researchers are tackling the issue—the most recent turning to materials science.

March 20, 2021 by Jake Hertz

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.

March 02, 2021 by Jake Hertz

Data Centers are Only Getting Hotter, But Circuit Cooling Techniques Can Help

Data centers are increasingly overburdened, which drives up the heat. What are some common methods to cool them down?

January 04, 2021 by Antonio Anzaldua Jr.

Thermoelectric Coolers: A Low-Power, Eco-Friendly Design Option for Temperature Control

Thermoelectric coolers (TECs) are increasingly replacing traditional refrigeration technology. But despite all the virtues of TECs, these devices are not without limitations.

November 12, 2020 by Antonio Anzaldua Jr.