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Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Infineon Wi-Fi 7 technology enables smart home with seamless interoperability, advanced environmental sensing, and energy-efficient connectivity.


Researchers Turn a Laser-Ionized Air Filament Into a Radio Antenna

Researchers Turn a Laser-Ionized Air Filament Into a Radio Antenna

A plasma filament driven through a contactless capacitive ring increased received signal strength 2.5 times at 30 MHz.


News Oct 26, 2026 by Luke James
Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Join us as we break down the humanoid system to examine key connectivity challenges and design approaches across vision, control, power distribution, and movement.


News Oct 21, 2026 by TE Connectivity
Microchip Unwraps New 10BASE‑T1S ICs to Scale Edge Connectivity

Microchip Unwraps New 10BASE‑T1S ICs to Scale Edge Connectivity

Two transceivers and a family of endpoints with integrated transceivers add to Microchip’s single pair Ethernet portfolio.


News Oct 14, 2026 by Duane Benson
Hubble Raises $200M to Connect Standard Bluetooth Devices by Satellite

Hubble Raises $200M to Connect Standard Bluetooth Devices by Satellite

The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.


News Oct 07, 2026 by Luke James
Nordic Rolls Out New Multiprotocol SoC for Size- and Cost-Effective IoT

Nordic Rolls Out New Multiprotocol SoC for Size- and Cost-Effective IoT

Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption and advanced security in a compact package for IoT devices.


News Oct 02, 2026 by Joshua Tidwell
Semtech Adds New Transceivers for ‘Complete Wireless IC Portfolio’

Semtech Adds New Transceivers for ‘Complete Wireless IC Portfolio’

The new members deliver fourth generation LoRa Plus IP-core compatible performance at less stringent tiers to complement flagship LR2021.


News Sep 14, 2026 by Duane Benson
Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.


News Sep 09, 2026 by Jeff Child
Bourns Adds LTCC Bandpass Filters for 5G C-Band RF Front Ends

Bourns Adds LTCC Bandpass Filters for 5G C-Band RF Front Ends

The new devices provide compact C-band filtering options for 5G RF front-end designs from 3,300 MHz to 5,000 MHz.


News Sep 01, 2026 by Austin Futrell
A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

The Nancy Grace Roman Space Telescope’s mirror may get the headlines, but its detector chips, photon-counting cameras, and downlink amplifier tell the electronics story.


News Aug 31, 2026 by Robert Martin
From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power Bluetooth Mesh sensing.


News Aug 28, 2026 by Joshua Tidwell
Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News Aug 24, 2026 by Luke James
Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity

Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity

The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.


News Aug 21, 2026 by Luke James
Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.


STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James