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Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.


STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox has introduced the MAYA-W5 and NORA-W5 Wi-Fi 6 module families for industrial and IoT applications, designed and manufactured in Europe.


News Jul 07, 2026 by Joshua Tidwell
Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.


News Jul 06, 2026 by Jake Hertz
Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.


News Jun 18, 2026 by Luke James
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
NXP Releases Radar SoC Featuring On-Sensor L2/L2+ ADAS Processing

NXP Releases Radar SoC Featuring On-Sensor L2/L2+ ADAS Processing

The SoC brings on-sensor L2/L2+ perception processing to entry-level vehicle platforms using NXP's 28-nm RFCMOS architecture.


News Jun 16, 2026 by Jake Hertz
Goodbye Cuff: AI Radar Monitors Heart Health Across the Room

Goodbye Cuff: AI Radar Monitors Heart Health Across the Room

A new prototype tracks pulse transit time at four points on the body using millimeter-wave chirps and neural networks, pointing toward ambient at-home heart monitoring.


News Jun 09, 2026 by Luke James
Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware

Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware

The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.


News Jun 03, 2026 by Luke James
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
U-blox Spans ADAS L2+ to L4 With Two Automotive GNSS Modules

U-blox Spans ADAS L2+ to L4 With Two Automotive GNSS Modules

U-blox has introduced the ZED-X20K and ZED-A20K GNSS modules for ADAS and autonomous vehicles, targeting scalable positioning and functional safety needs.


News May 26, 2026 by Joshua Tidwell
Microchip’s 100/1000BASE‑T1 SPE PHYs Pack Security and Safety Features

Microchip’s 100/1000BASE‑T1 SPE PHYs Pack Security and Safety Features

The new 100/1000BASE-T1 transceiver families integrate IEEE 802.1AE-2018 frame security and TSN, targeting ADAS, zonal architectures, and industrial automation.


News May 20, 2026 by Luke James
PCIe 7.0 Roundup: Test and Timing Tools Emerge as Ecosystem Takes Shape

PCIe 7.0 Roundup: Test and Timing Tools Emerge as Ecosystem Takes Shape

To support the transition to PCIe 7.0, three companies have introduced new automated testing applications, ultra-low-jitter clock generators, and protocol analysis platforms to bridge critical gaps in the existing market ecosystem.


News May 19, 2026 by Jake Hertz
Rohm Announces Compact Wireless Charging Chipset for Wearables

Rohm Announces Compact Wireless Charging Chipset for Wearables

The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power integration in ultra-compact wearable devices, such as smart rings.


News May 18, 2026 by Austin Futrell
Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.


News May 12, 2026 by Luke James
Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.


News Apr 29, 2026 by Luke James
Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Two new product families pair Pragmatic's PR1301 chip with paper antennas to push smart packaging beyond silicon RFID's cost and material floor.


News Apr 27, 2026 by Luke James
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller