By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh…
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.
Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.
Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
Today, the FPGA company revealed an array of new announcements at its annual Altera Innovators Day developer conference.
Today, the FPGA company revealed an array of new announcements at its annual Altera Innovators Day developer conference.
The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
Together, the new solutions skirt the heat associated with AI compute without compromising performance.
Together, the new solutions skirt the heat associated with AI compute without compromising performance.
The new chip is the low-power variant of its MM8108 cousin, designed to support low-power, long-range connectivity in IoT…
The new chip is the low-power variant of its MM8108 cousin, designed to support low-power, long-range connectivity in IoT deployments.
Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a…
Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.
New IoT security legislation is coming down the pipe. Microchip has released a mixed-range family of MCUs that keep data…
New IoT security legislation is coming down the pipe. Microchip has released a mixed-range family of MCUs that keep data security and functional safety at the forefront.
Enjoy this taste of the rich collection of technology news from last week’s Embedded World trade show in Nuremberg, Germany.
Enjoy this taste of the rich collection of technology news from last week’s Embedded World trade show in Nuremberg, Germany.
Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg…
Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.
With support for a bevy of wireless standards, the latest NXP MCUs, unveiled at Embedded World 2024, ease the transition…
With support for a bevy of wireless standards, the latest NXP MCUs, unveiled at Embedded World 2024, ease the transition to a connected world.
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are…
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are racing to keep pace.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power…
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.
Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.
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