Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver…
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a…
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in…
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech,…
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular…
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular framework and configuration tool unification.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the…
Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the demanding workloads brought on by generative AI.
Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply…
Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.
This year’s Plugfest helped validate I3C and build out its ecosystem amongst some of the industry’s leaders.
This year’s Plugfest helped validate I3C and build out its ecosystem amongst some of the industry’s leaders.
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