While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are still hard at work developing better memory technology for enhanced compute potential.
April 08, 2021 by Adrian Gibbons
Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research projects are taking on the challenge.
April 05, 2021 by Jake Hertz
With mounting data demands, Samsung has unveiled a new DDR5 module with HKMG process technology to accommodate AI, ML, and supercomputing applications.
April 02, 2021 by Antonio Anzaldua Jr.
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.
March 02, 2021 by Antonio Anzaldua Jr.
Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.
January 27, 2021 by Jake Hertz
Keeping with the trend to depart from von Neumann architectures, French researchers have overcome non-ideal properties of memristors to bring Bayesian networks to the edge.
January 23, 2021 by Jake Hertz
Despite the pandemic, 2020 was a monumental year for space exploration. And pivotal to each mission's success at the circuit level was radiation-hardened memory devices.
December 21, 2020 by Tyler Charboneau
According to IC Insights, DRAM was the biggest IC product category for 2020 with sales of $65.2 billion, followed by NAND coming in second at $55.2 billion.
December 10, 2020 by Luke James
Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?
November 06, 2020 by Steve Arar
As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).
October 29, 2020 by Steve Arar
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.
October 26, 2020 by Steve Arar
This week, Arm announced that it will transfer its entire CeRAM IP portfolio to a new spin-out from the company, Cerfe Labs, while taking minority ownership stake in the new company.
October 08, 2020 by Jake Hertz
With no definitive release date for DDR5, DDR4 is making significant strides.
September 18, 2020 by Antonio Anzaldua Jr.
This week, Renesas has released their newest product: a data buffer for DDR5 aimed at empowering a new generation of high-performance computing applications.
September 11, 2020 by Jake Hertz
Using PCIe protocols, NVMe addresses the issue of data rate bottlenecks—proving to be even faster than SAS and SATA protocols purpose-built for hard disk drives.
August 11, 2020 by Steve Arar
Using van der Waals materials, USC researchers have made a breakthrough in non-volatile memory based on ferroelectric tunnel junctions.
July 27, 2020 by Jake Hertz
The new device supports a staggeringly high 460 gigabyte per second bandwidth.
July 03, 2020 by Gary Elinoff
Three newly-released FPGAs can tell us a lot about the direction of these devices in the industry.
July 02, 2020 by Steve Arar
What is magnetic skyrmion? And how might it be a key to more power-efficient magnetic memory?
July 02, 2020 by Jake Hertz
How exactly do error correction codes work and how do they affect the integrity of an MCU? A new ECC-protected Arm Cortex-M4F MCU from Maxim Integrated serves as a real-world example.
June 23, 2020 by Jake Hertz
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