One of the trickiest aspects of chip design is figuring out how to pack more circuitry into a smaller footprint while maintaining power, speed, and energy efficiency.
20 hours ago by Luke James
Osaka University researchers have built a new device that can be customized by the user for maximum efficiency in AI applications.
March 13, 2020 by Luke James
Apple ultimately canceled its wireless power program because of coil alignment. Three new platforms aim to work around the problem that slowed the tech giant down.
March 02, 2020 by Kayla Matthews
In this article, we'll assess a few examples of new ASICs on the market that may be of use to designers working with 5G-bound designs.
February 28, 2020 by Robin Mitchell
Dialog Semiconductor's latest IO-Link IC integrates advanced circuit protection and low power dissipation into a 3 mm x 3 mm package.
February 26, 2020 by Robin Mitchell
In this article, we'll take a closer look at recently available smartphone chips and how these chips are responding to higher demands of processing and memory.
February 11, 2020 by Lisa Boneta
The ISL70005SEH, geared for satellite orbit, incorporates both a synchronous buck converter and a low dropout (LDO) regulator in one monolithic IC.
January 31, 2020 by Gary Elinoff
inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.
January 29, 2020 by Robin Mitchell
Five thousand industry professionals and more than 175 suppliers will be on hand to present their latest design tools, technologies, and new advancements.
January 28, 2020 by Cabe Atwell
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.
January 06, 2020 by Gary Elinoff
The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for physical buttons.
January 03, 2020 by Cabe Atwell
Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.
December 18, 2019 by Cabe Atwell
The Core-V Chassis evaluation SoC will feature a CV64A 64-bit core and a CV32E 32-bit coprocessor core as well as 3D and 2D GPUs.
December 13, 2019 by Cabe Atwell
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
December 10, 2019 by Lisa Boneta
Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.
December 09, 2019 by Gary Elinoff
Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.
December 03, 2019 by Majeed Ahmad
The new 7nm SoC is the first device in a chipset family offering integrated 5G modems.
December 03, 2019 by Gary Elinoff
These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.
November 23, 2019 by Robin Mitchell
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