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Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

September 25, 2023 by Duane Benson

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.

September 25, 2023 by Barbara Vergetis Lundin

AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.

September 21, 2023 by Aaron Carman

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC

September 15, 2023 by Duane Benson

Memory, Processing, & Security: Focal Points of New Automotive Releases

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.

September 13, 2023 by Darshil Patel

Semiconductor Skills Shortage May Escalate to ‘Crisis’ by 2030

Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the world, it now faces an unprecedented challenge.

August 14, 2023 by Jake Hertz

IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex AI challenges.

August 14, 2023 by Aaron Carman

Startup HaiLa Aims Its Ambient IoT Tech at a ‘No Batteries’ IoT Future

Emerging from stealth mode, HaiLa believes they can enable a future of IoT nodes without batteries.

August 01, 2023 by Jake Hertz

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.

July 17, 2023 by Darshil Patel

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.

July 12, 2023 by Jake Hertz

What Intel’s European Investments Say About Its Tech Roadmap

Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those funds looks like.

June 29, 2023 by Chantelle Dubois

AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.

June 27, 2023 by Jake Hertz

With PowerVia Backside Power, Intel Anticipates Big Chip Breakthroughs

Intel has unveiled a new backside power delivery technology called PowerVia, which decouples power and signal interconnects on a wafer to increase performance and lower costs.

June 22, 2023 by Arjun Nijhawan

Intel Makes New Quantum Chip Available to Research Community

Tunnel Falls removes barriers to entry for quantum research by leveraging traditional transistor processes for high-yield fabrication.

June 19, 2023 by Aaron Carman

Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink UCIe interconnect offers advantages over silicon interposer approaches.

June 19, 2023 by Duane Benson

Exclusive Interview: NYU Team Taps ChatGPT to Design Processor From Scratch

Using plain English—not a hardware definition language—a group of researchers used generative AI to successfully design a microprocessor.

June 16, 2023 by Jake Hertz

Photonic Chip Design Rethink Could Cut Data Center Energy Use

Leveraging novel photonic circuit designs, researchers hope to lower electricity consumption in data centers.

June 02, 2023 by Kristijan Nelkovski

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).

May 31, 2023 by Jake Hertz

Intel Rolls First FPGA with PCIe 5.0 and Compute Express Link

By embedding PCI Express 5.0 and CXL support, Intel’s new FPGAs seek to tackle high-bandwidth computing workloads.

May 25, 2023 by Chantelle Dubois

Broadcom to Supply Apple’s 5G Components in the US

Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.

May 24, 2023 by Jake Hertz