In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption…
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption and advanced security in a compact package for IoT devices.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated…
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.
The XMC-1200 is a 1-mm-thin piezoMEMS cooling chip designed to keep heat away from temple arms.
The XMC-1200 is a 1-mm-thin piezoMEMS cooling chip designed to keep heat away from temple arms.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut…
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power…
The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power integration in ultra-compact wearable devices, such as smart rings.
New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.
New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at…
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs…
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.
The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces…
The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.
The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity…
The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for…
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.
The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables,…
The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.
The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog…
The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
RA6W1 is a dual-band Arm Cortex-M33 platform that targets low-power connected devices.
RA6W1 is a dual-band Arm Cortex-M33 platform that targets low-power connected devices.
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