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From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power Bluetooth Mesh sensing.


News About 4 hours ago by Joshua Tidwell
Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News Aug 24, 2026 by Luke James
Melexis Unwraps Code-Free Single Coil Fan Drivers for AI CPU Systems

Melexis Unwraps Code-Free Single Coil Fan Drivers for AI CPU Systems

The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.


News Aug 11, 2026 by Joshua Tidwell
Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.


News Aug 11, 2026 by Jake Hertz
Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.


News Aug 04, 2026 by Jake Hertz
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.


News Jul 27, 2026 by Joshua Tidwell
Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.


News Jul 27, 2026 by Luke James
Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.


News Jul 21, 2026 by Dale Wilson
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.


News Jun 26, 2026 by Duane Benson
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

The new switch IP targets AI and data center SoCs that need to move data efficiently across CPUs, GPUs, accelerators, and NVMe storage without adding more physical lanes.


News May 15, 2026 by Luke James