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Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.


News Aug 04, 2026 by Jake Hertz
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.


News Jul 27, 2026 by Joshua Tidwell
Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.


News Jul 27, 2026 by Luke James
Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.


News Jul 21, 2026 by Dale Wilson
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.


News Jun 26, 2026 by Duane Benson
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

The new switch IP targets AI and data center SoCs that need to move data efficiently across CPUs, GPUs, accelerators, and NVMe storage without adding more physical lanes.


News May 15, 2026 by Luke James
Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco designed the Universal Quantum Switch to connect quantum systems using different encoding methods, marking a major step toward scalable quantum networking over existing telecom infrastructure.


News May 14, 2026 by Joshua Tidwell
Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.


News May 06, 2026 by Duane Benson
Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller