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Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficiency targets.


News Oct 07, 2026 by Dale Wilson
Summit 2026 - From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure

Summit 2026 - From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure

From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure


News Oct 07, 2026 by Tektronix
Summit 2026 - The Evolution of SiC Power Devices: Why Cascode and Dual Drive JFETs Matter

Summit 2026 - The Evolution of SiC Power Devices: Why Cascode and Dual Drive JFETs Matter

Discover how a new generation of normally-off SiC JFETs is emerging as a compelling alternative to mainstream SiC MOSFETs, driving new levels of efficiency, power density, and reliability.


Summit 2026 - Achieving 80 PLUS Certification: Precision Efficiency Testing for Server PSUs

Summit 2026 - Achieving 80 PLUS Certification: Precision Efficiency Testing for Server PSUs

Discover how precision power analyzers enable accurate efficiency measurements for data server power supplies and help meet 80 PLUS certification requirements under challenging load conditions.


News Oct 07, 2026 by Rohde & Schwarz
Summit 2026 - The Hidden Tech Powering AI: Advanced Magnetics for Next-Gen Data Centers

Summit 2026 - The Hidden Tech Powering AI: Advanced Magnetics for Next-Gen Data Centers

As AI power demands grow, advanced magnetics, protection, and power management technologies are enabling more efficient, reliable, and scalable data center architectures.


Summit 2026 - Optimizing Power Supply Units for Next Gen AI Data Centers

Summit 2026 - Optimizing Power Supply Units for Next Gen AI Data Centers

Explore emerging rack architectures and cutting-edge power supply unit (PSU) topologies with Infineon Technologies. Learn how Silicon, GaN, and SiC reference designs enable highly efficient, scalable systems.


Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.


News Oct 07, 2026 by Dale Wilson
Rambus Gets to the Root of SoC Security With Caliptra Support

Rambus Gets to the Root of SoC Security With Caliptra Support

Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and lifecycle management for data center and AI chips.


News Oct 06, 2026 by Joshua Tidwell
Recent Semiconductor Deals Reflect Uptick in AI and Quantum Development

Recent Semiconductor Deals Reflect Uptick in AI and Quantum Development

Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices highlight growing investment in AI infrastructure, quantum manufacturing, optical connectivity, and edge intelligence.


News Sep 23, 2026 by Austin Futrell
AtlasBase Debuts Bio-Silicon Chip for Breaking Data Center Storage Bottlenecks

AtlasBase Debuts Bio-Silicon Chip for Breaking Data Center Storage Bottlenecks

Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density bottlenecks in AI data center storage and molecular computing.


News Sep 22, 2026 by Jeff Child
Delos Data Unveils Architecture and Silicon to Break AI Interconnect Bottlenecks

Delos Data Unveils Architecture and Silicon to Break AI Interconnect Bottlenecks

Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.


News Sep 15, 2026 by Jeff Child
Apple Targets AI Compute With New M6 and M5 Ultra Processors

Apple Targets AI Compute With New M6 and M5 Ultra Processors

M6 is Apple's first 2-nm chip and features a dual 16-core Neural Engine, while the M5 Ultra joins four dies to achieve 1.2 TB/s of unified memory bandwidth.


News Sep 11, 2026 by Jake Hertz
Arm Rolls AI-Native Compute Platforms for Edge, Physical, and Cloud Systems

Arm Rolls AI-Native Compute Platforms for Edge, Physical, and Cloud Systems

Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.


News Sep 07, 2026 by Jeff Child
IBM & Arm Reveal Fruits of Partnership: The First Dual-Architecture CPU

IBM & Arm Reveal Fruits of Partnership: The First Dual-Architecture CPU

The 2-nm processor runs Arm and z/Architecture instructions natively on the same core.


News Sep 02, 2026 by Jake Hertz
MaxLinear Unveils Control-Plane Portfolio for Next-Gen AI Infrastructure

MaxLinear Unveils Control-Plane Portfolio for Next-Gen AI Infrastructure

RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.


News Aug 31, 2026 by Jake Hertz
From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

From BMW to Data Centers: Brands Tap 3 Known Chips in New Ways

Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power Bluetooth Mesh sensing.


News Aug 28, 2026 by Joshua Tidwell
Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News Aug 24, 2026 by Luke James
Melexis Unwraps Code-Free Single Coil Fan Drivers for AI CPU Systems

Melexis Unwraps Code-Free Single Coil Fan Drivers for AI CPU Systems

The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.


News Aug 11, 2026 by Joshua Tidwell
Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.


News Aug 11, 2026 by Jake Hertz
Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.


News Aug 04, 2026 by Jake Hertz