The new environmental tracker employs Nordic Semiconductor's cellular IoT and Bluetooth technologies and features a five-year battery life.
December 30, 2019 by Gary Elinoff
Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.
December 28, 2019 by Gary Elinoff
The XCVU13P module incorporates 52 multi-gigabit transceivers for stable performance up to 32.75Gbps.
December 26, 2019 by Gary Elinoff
In a bid to galvanize its own AI future, Intel has acquired advanced AI training and inference silicon technology.
December 21, 2019 by Tyler Charboneau
Intel’s Horse Ridge chip is expected to speed up the development of commercially viable quantum computers and burn a path to scaling larger systems.
December 12, 2019 by Cabe Atwell
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
December 10, 2019 by Lisa Boneta
The new kit offers out-of-the-box support for full desktop Linux and is compatible with many peripherals that support 4K, including Ethernet, USB, and HDMI.
December 06, 2019 by Lisa Boneta
Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.
December 03, 2019 by Majeed Ahmad
The platform supports 5G applications at the edge through a Single Pane of Glass—the automated management of thousands of nodes.
November 19, 2019 by Robin Mitchell
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
November 11, 2019 by Lisa Boneta
The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.
November 09, 2019 by Gary Elinoff
Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.
November 08, 2019 by Cabe Atwell
Concord Pro allows each player in the design process to share up-to-date component information.
November 01, 2019 by Gary Elinoff
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.
October 28, 2019 by Gary Elinoff
MWC2019 Los Angeles begins today, giving us a chance to reflect on the past 10 months in connectivity.
October 22, 2019 by Gary Elinoff
Arm TechCon begins today in San Jose, CA. Here's what you need to know.
October 08, 2019 by Gary Elinoff
You might use ANNs for machine vision, but did you know it can predict weather, track animal behavior, and unlock the secrets of cosmology?
October 04, 2019 by Lisa Boneta
Renesas and StradVision are leveling up automotive camera solutions with deep learning for object recognition on low-power SoCs.
September 30, 2019 by Gary Elinoff
Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.
August 28, 2019 by Gary Elinoff
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