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STMicroelectronics Designs Wireless Support for ST8500 Chipset in Smart Meters

The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.

20 hours ago by Cabe Atwell

STM32’s LoRaWAN Software Upgraded to Support Latest Firmware Over-the-Air Updates

The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.

3 days ago by Lisa Boneta

GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.

4 days ago by Gary Elinoff

TE’s New Multi-Sensor Module Geared to Push Smart Devices to Market Faster

The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.

November 06, 2019 by Gary Elinoff

Reader Question: How Do You Use Modules and Modular Design?

Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?

November 02, 2019 by Kate Smith

US-based Mobile World Conference 2019 Kicks off in Los Angeles, Doubles Down on 5G, AI, and IoT

MWC2019 Los Angeles begins today, giving us a chance to reflect on the past 10 months in connectivity.

October 22, 2019 by Gary Elinoff

u-blox Expands Its Bluetooth Portfolio with Three New BLE Modules

New members of the BMD product series encompass both indoor and long-range Bluetooth solutions.

October 16, 2019 by Gary Elinoff

BehrTech and MAJiK Systems Devise a Brownfield, IIoT Solution for Legacy PLCs

Legacy systems can now reap the benefits of the Industrial Internet of Things without PLC reprogramming.

October 11, 2019 by Gary Elinoff

IoT Roundup: New Wireless Protocols Extend Coverage and Memory

As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.

October 10, 2019 by Hannah DeTavis

Renesas Introduces Security-Focused RA Family of Arm-Based MCUs

The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.

October 09, 2019 by Gary Elinoff

Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.

October 08, 2019 by Gary Elinoff

Arm TechCon 2019 Explores the Convergence of AI, 5G, and IoT

Arm TechCon begins today in San Jose, CA. Here's what you need to know.

October 08, 2019 by Gary Elinoff

Where KNX Stands in Building Automation Designs

The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety.

September 12, 2019 by Majeed Ahmad

Renesas Releases RX65N Cloud Kit For IoT Product Development

This week, Renesas released a new IoT development kit, the RX65N Wi-Fi Connectivity Cloud Kit. What can this kit do and how can it help develop the latest IoT products?

August 20, 2019 by Robin Mitchell

DEF CON 27 Demonstrates Real-World Security Issues for MCUs, Medical Devices, Cars, and More

The recent hacker cavalcade was a chance for security matters to take center stage, both for those defending the integrity of electronics and those challenging it.

August 19, 2019 by Gary Elinoff

Vesper Releases New MEMS VM3000 Microphone

Vesper has announced their first piezoelectric digital MEMS microphone for audio applications in voice recognition.

July 26, 2019 by Robin Mitchell

InnoPhase Wants to Move RF Circuitry Away from Analog

InnoPhase wants to change digital radio architecture. Here's a look at the why and how.

July 25, 2019 by Robin Mitchell

Secure Microcontrollers Address IoT Security

Security is increasingly something EEs need to be cognizant of in their component choices. Here's an overview of three secure microcontrollers.

July 23, 2019 by Gary Elinoff

The Benefits and Potential Drawbacks of the Switch to 5G Antennas

5G is the latest wireless technology for mobile devices and promises considerably higher data rates, lower latency, and increased number of instantaneous connections. But how will current infrastructure cope with the change and what will this mean to current 4G hardware?

July 15, 2019 by Robin Mitchell

Xilinx Hails New Single-chip Microprocessors as the “World’s Highest Performing” for ADAS

The single chip integrates 64-bit quad-core Arm Cortex-A53 and the dual-core Arm Cortex-R5 based processing system.

About 4 hours ago by Lisa Boneta

STMicroelectronics Designs Wireless Support for ST8500 Chipset in Smart Meters

The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.

20 hours ago by Cabe Atwell

Vishay Introduces Low-profile Commercial Inductors in 1212 Case Size

The three new members of Vishay's IHLP family feature inductances ranging from 0.10 to 3.3 µH and profiles as low as 1.0 mm.

one day ago by Gary Elinoff

Analog Devices Reveals a Low-power PHY Chip for the Industrial Ethernet

The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.

2 days ago by Gary Elinoff

ams Unveils Family of Digital Temperature Sensors for Tight Thermal Control

Sized at only 1.5 mm2, members of the AS621x family offer a range of temperature accuracies for design flexibility.

3 days ago by Gary Elinoff

STM32’s LoRaWAN Software Upgraded to Support Latest Firmware Over-the-Air Updates

The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.

3 days ago by Lisa Boneta

GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.

4 days ago by Gary Elinoff

New AI Secures Public Spaces Using Security Cameras, Drone Surveillance, and Facial Recognition

The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.

November 09, 2019 by Gary Elinoff

Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.

November 08, 2019 by Gary Elinoff

Google Launches Open-Source OpenTitan Project for Silicon Root of Trust Chips

Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.

November 08, 2019 by Cabe Atwell

Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.

November 07, 2019 by Gary Elinoff

Wind River Systems Announces New Version of Simics for Stronger Cybersecurity and DevOps

The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.

November 06, 2019 by Lisa Boneta

TE’s New Multi-Sensor Module Geared to Push Smart Devices to Market Faster

The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.

November 06, 2019 by Gary Elinoff

New ams Color Sensor Designed to Eliminate Flicker in Rolling Shutter Sensors

The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.

November 05, 2019 by Gary Elinoff

TI Rolls Out New ADC for Improved Voice Capture in Noisy, Far-field Environments

TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.

November 05, 2019 by Lisa Boneta

Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.

November 04, 2019 by Robin Mitchell

Reader Question: How Do You Use Modules and Modular Design?

Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?

November 02, 2019 by Kate Smith

Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Concord Pro allows each player in the design process to share up-to-date component information.

November 01, 2019 by Gary Elinoff

Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.

November 01, 2019 by Lisa Boneta

Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.

October 31, 2019 by Gary Elinoff