Sized at only 1.5 mm2, members of the AS621x family offer a range of temperature accuracies for design flexibility.
3 days ago by Gary Elinoff
The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.
November 09, 2019 by Gary Elinoff
The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.
November 06, 2019 by Gary Elinoff
The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.
November 05, 2019 by Gary Elinoff
The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.
October 23, 2019 by Gary Elinoff
TDK's newest devices span applications in both liquid and air-based media.
September 20, 2019 by Gary Elinoff
A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms.
September 05, 2019 by Majeed Ahmad
DARPA’s Subterranean (SubT) Challenge seeks to find new ways to cope with complex underground environments.
September 02, 2019 by Gary Elinoff
Learn the different ways companies are using time-of-flight 3D sensor technology to create products for facial recognition, smart cars, and manufacturing.
August 24, 2019 by Gary Elinoff
Energy harvesting is something that many engineers have heard of but MIT has taken this concept to a whole new level with an underwater sensor that has no battery.
August 21, 2019 by Robin Mitchell
This week, Renesas released a new IoT development kit, the RX65N Wi-Fi Connectivity Cloud Kit. What can this kit do and how can it help develop the latest IoT products?
August 20, 2019 by Robin Mitchell
Maxim claims their newest temperature sensor and heart-rate monitor are "lowest-power" with clinical-grade accuracy.
July 30, 2019 by Gary Elinoff
DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.
July 29, 2019 by Gary Elinoff
Vesper has announced their first piezoelectric digital MEMS microphone for audio applications in voice recognition.
July 26, 2019 by Robin Mitchell
Researchers from a Korean university have studied octopus to learn how to make better stick-on wearable sensors.
July 19, 2019 by Nidia Trejo
Built with inexpensive hardware components, ROHM's algorithm-based module has built-in false detection function.
July 11, 2019 by Gary Elinoff
Smart cities are exploiting the power of the Internet of Things to prevent wasting water.
July 10, 2019 by Gary Elinoff
Researchers have combined wearable biosensors with machine learning to aid in treatment for substance abuse.
July 09, 2019 by Orlando Hoilett
The first image of a black hole made global headlines. Here are two engineers that helped make it happen.
July 08, 2019 by Mark Hughes
The industrial IoT was the talk of Sensors Expo this year. Here's a roundup of some of the elements of the IIoT.
July 02, 2019 by Gary Elinoff
The single chip integrates 64-bit quad-core Arm Cortex-A53 and the dual-core Arm Cortex-R5 based processing system.
3 hours ago by Lisa Boneta
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
19 hours ago by Cabe Atwell
The three new members of Vishay's IHLP family feature inductances ranging from 0.10 to 3.3 µH and profiles as low as 1.0 mm.
About 24 hours ago by Gary Elinoff
The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.
2 days ago by Gary Elinoff
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
3 days ago by Lisa Boneta
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
4 days ago by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.
November 08, 2019 by Cabe Atwell
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.
November 06, 2019 by Lisa Boneta
TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.
November 05, 2019 by Lisa Boneta
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
November 04, 2019 by Robin Mitchell
Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?
November 02, 2019 by Kate Smith
Concord Pro allows each player in the design process to share up-to-date component information.
November 01, 2019 by Gary Elinoff
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.
October 31, 2019 by Gary Elinoff
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