The single chip integrates 64-bit quad-core Arm Cortex-A53 and the dual-core Arm Cortex-R5 based processing system.
About 3 hours ago by Lisa Boneta
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
19 hours ago by Cabe Atwell
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
3 days ago by Lisa Boneta
Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.
November 08, 2019 by Cabe Atwell
The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.
November 06, 2019 by Lisa Boneta
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
November 04, 2019 by Robin Mitchell
Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.
October 28, 2019 by Gary Elinoff
New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.
October 24, 2019 by Gary Elinoff
ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.
October 17, 2019 by Gary Elinoff
New members of the BMD product series encompass both indoor and long-range Bluetooth solutions.
October 16, 2019 by Gary Elinoff
The newly announced Click board series extends the reach of ST's STSPIN motor driver ICs into the Mikroe ecosystem.
October 14, 2019 by Gary Elinoff
The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.
October 09, 2019 by Gary Elinoff
Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.
October 08, 2019 by Gary Elinoff
Arm TechCon begins today in San Jose, CA. Here's what you need to know.
Renesas and StradVision are leveling up automotive camera solutions with deep learning for object recognition on low-power SoCs.
September 30, 2019 by Gary Elinoff
Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon carbide device manufacturing facility in the world.
September 26, 2019 by Gary Elinoff
Dialog Semi's four new high-frequency, I2C-controlled buck converters aim to save onboard space and external component count.
September 19, 2019 by Gary Elinoff
The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.
September 15, 2019 by Gary Elinoff
The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety.
September 12, 2019 by Majeed Ahmad
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
September 09, 2019 by Gary Elinoff
The three new members of Vishay's IHLP family feature inductances ranging from 0.10 to 3.3 µH and profiles as low as 1.0 mm.
About 24 hours ago by Gary Elinoff
The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.
2 days ago by Gary Elinoff
Sized at only 1.5 mm2, members of the AS621x family offer a range of temperature accuracies for design flexibility.
3 days ago by Gary Elinoff
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
4 days ago by Gary Elinoff
The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.
November 09, 2019 by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.
November 06, 2019 by Gary Elinoff
The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.
November 05, 2019 by Gary Elinoff
TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.
November 05, 2019 by Lisa Boneta
Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?
November 02, 2019 by Kate Smith
Concord Pro allows each player in the design process to share up-to-date component information.
November 01, 2019 by Gary Elinoff
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.
October 31, 2019 by Gary Elinoff
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