Latest Smartwatches News

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for…

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.

The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.

ST claims the new two-in-one MEMS accelerometer can measure events ranging from minor movements to intense impacts with…

ST claims the new two-in-one MEMS accelerometer can measure events ranging from minor movements to intense impacts with equal accuracy.

ST’s new solution has a highly integrated analog front end for advanced wearable features.

ST’s new solution has a highly integrated analog front end for advanced wearable features.

The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm…

The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package

With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.

With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.

The new MEMS devices have a 76% smaller footprint than Bosch’s current generation of acceleration sensors.

The new MEMS devices have a 76% smaller footprint than Bosch’s current generation of acceleration sensors.

The new analog front end integrates a number of major vital sign monitors into a single device for wearable designs.

The new analog front end integrates a number of major vital sign monitors into a single device for wearable designs.

At the 2023 North America RISC-V Summit, dozens of presenters will showcase RISC-V innovations in desktop computing and…

At the 2023 North America RISC-V Summit, dozens of presenters will showcase RISC-V innovations in desktop computing and wearable applications.

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board…

Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board designed both for development and and for embedding into your design.

Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an…

Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.

OxiWear’s new pulse-oximeter solution highlights the potential use cases for Nordic’s nRF52840.

OxiWear’s new pulse-oximeter solution highlights the potential use cases for Nordic’s nRF52840.

With a goal of serving the design needs of small form-factor embedded systems, Silicon Labs is rolling out families of…

With a goal of serving the design needs of small form-factor embedded systems, Silicon Labs is rolling out families of MCUs and wireless SoCs in tiny packages.

At Embedded World 2023, NXP unveils a chip that integrates a microcontroller, an NFC front end, and security into a single IC.

At Embedded World 2023, NXP unveils a chip that integrates a microcontroller, an NFC front end, and security into a single IC.

Offering compact packaging, BLE functions, and more, today’s power management integrated circuits (PMICs) are meeting…

Offering compact packaging, BLE functions, and more, today’s power management integrated circuits (PMICs) are meeting the technology needs of a variety of system designs.