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Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News 3 hours ago by Austin Futrell
IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
It’s Been a Busy Summer for Semiconductor Acquisitions

It’s Been a Busy Summer for Semiconductor Acquisitions

Four deals target edge AI hardware and software, data center cooling, and embedded development tools.


News Jul 10, 2026 by Luke James
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.


News Jul 01, 2026 by Jake Hertz
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.


News Jun 25, 2026 by Luke James
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson