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Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News 4 hours ago by Luke James
Researchers Use Photons & Phonons for Long-Distance Qubit Communication

Researchers Use Photons & Phonons for Long-Distance Qubit Communication

The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.


News Aug 18, 2026 by Dr. Steve Arar
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
NXP Tunes Into Automotive Infotainment With Hybrid Radio-AI Processor

NXP Tunes Into Automotive Infotainment With Hybrid Radio-AI Processor

The compact system footprint and streamlined integration may help automakers adapt to shifting radio policies.


News Aug 06, 2026 by Joshua Tidwell
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
IMEC and Diraq Tow the Quantum Line With Foundry-Compatible Spin Qubits

IMEC and Diraq Tow the Quantum Line With Foundry-Compatible Spin Qubits

The two research groups teamed up to demonstrate the first coherent operation of an eight-silicon-MOS spin-qubit array.


News Jul 31, 2026 by Duane Benson
MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.


News Jul 22, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
It’s Been a Busy Summer for Semiconductor Acquisitions

It’s Been a Busy Summer for Semiconductor Acquisitions

Four deals target edge AI hardware and software, data center cooling, and embedded development tools.


News Jul 10, 2026 by Luke James
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.


News Jul 01, 2026 by Jake Hertz
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.


News Jun 25, 2026 by Luke James
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson