GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.
GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a…
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm…
In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.
The startup's programmable chip uses a metasurface architecture to control light without moving parts.
The startup's programmable chip uses a metasurface architecture to control light without moving parts.
The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog…
The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.
NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with…
NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.
Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.
Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next…
Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.
Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications,…
Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.
Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in…
Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.
Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and…
Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and scaled from the mid-1960s through the early microprocessor age.
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts…
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.
New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals…
New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software…
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods.…
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in…
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for…
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.
ST says its new microprocessors balance application-class performance, real-time control, and power management.
ST says its new microprocessors balance application-class performance, real-time control, and power management.
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