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NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.


News Mar 17, 2026 by Jake Hertz
Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.


News Mar 16, 2026 by Duane Benson
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.


News Mar 12, 2026 by Jake Hertz
Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Inside the 7400-Series Era of Digital Logic

Inside the 7400-Series Era of Digital Logic

Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and scaled from the mid-1960s through the early microprocessor age.


News Feb 27, 2026 by Luke James
ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.


News Feb 17, 2026 by Luke James
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.


News Feb 04, 2026 by Jake Hertz
ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST says its new microprocessors balance application-class performance, real-time control, and power management.


News Feb 03, 2026 by Jake Hertz
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.


News Jan 27, 2026 by Austin Futrell
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
How Brain-Inspired Hardware Is Learning to Scale

How Brain-Inspired Hardware Is Learning to Scale

While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.


News Jan 20, 2026 by Austin Futrell