Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing…
Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.
Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and…
Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and scaled from the mid-1960s through the early microprocessor age.
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts…
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.
New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals…
New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software…
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods.…
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in…
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for…
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.
ST says its new microprocessors balance application-class performance, real-time control, and power management.
ST says its new microprocessors balance application-class performance, real-time control, and power management.
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide…
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI…
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems…
While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto…
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.
All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.
All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.
At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the…
At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.
The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI…
The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
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