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Summit 2026 - The Advantages of Reverberation Chambers for Automotive EMC Testing

Summit 2026 - The Advantages of Reverberation Chambers for Automotive EMC Testing

EMC testing is getting more complex. Discover how reverberation chambers deliver fast, repeatable, energy-efficient stress testing for autonomous, connected, electrified vehicles.


News Oct 14, 2026 by Rohde & Schwarz
Summit 2026 - Infineon Automotive Smart Power Stages: An Overview

Summit 2026 - Infineon Automotive Smart Power Stages: An Overview

Explore how DrMOS devices enable multiphase buck topologies. See an 8-phase core rail demo using Infineon Smart Power Stage TLF12505A for steady-state and dynamic response to load transients.


Exclusive—Renesas Exec Talks Humanoid Robotics, Analog Solutions, and More

Exclusive—Renesas Exec Talks Humanoid Robotics, Analog Solutions, and More

In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.


News Oct 05, 2026 by Jeff Child
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child
Littelfuse Intros Asymmetrical TVS Diode Series for 12 V Battery Protection

Littelfuse Intros Asymmetrical TVS Diode Series for 12 V Battery Protection

The new devices target anti-reverse circuits with lower negative clamping voltages and simplified front-end design.


News Dec 12, 2025 by Luke James
Rohm Adds High-Accuracy Sense Apps for High-Voltage Designs

Rohm Adds High-Accuracy Sense Apps for High-Voltage Designs

The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other automotive systems.


News Jul 10, 2025 by Jake Hertz
TDK Unveils 6-Axis IMU Aimed at In-Cabin Automotive Designs

TDK Unveils 6-Axis IMU Aimed at In-Cabin Automotive Designs

Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.


News Jun 24, 2025 by Jake Hertz
EW ‘25 Exclusive—Nuvoton’s President Talks AI, Automotive, IoT, and Sustainability

EW ‘25 Exclusive—Nuvoton’s President Talks AI, Automotive, IoT, and Sustainability

We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI embedded development, automotive, IoT, sustainability, and the forecast for 2025.


News Mar 24, 2025 by Jeff Child
Infineon Expands Gate Drive ICs for EV Traction Inverters

Infineon Expands Gate Drive ICs for EV Traction Inverters

Infineon’s isolated gate driver ICs support the latest IGBT and SiC technologies, improving efficiency, reliability, and safety in EV powertrains.


News Feb 17, 2025 by Luke James
Tesla Standardizing EV Connectors

Tesla Standardizing EV Connectors

Tesla aims to reduce the number of connectors required in an electric vehicle.


News Dec 03, 2024 by Jake Hertz
High-Power PCB Relay Keeps EV Charging Cool

High-Power PCB Relay Keeps EV Charging Cool

Omron’s 4-pole relay fits on a PCB to reduce the heat generated in three-phase power electric vehicle wallboxes during high-power charging.


News Sep 05, 2024 by Liam Critchley
12 Major Japanese Firms Team Up for Automotive SoC Research Initiative

12 Major Japanese Firms Team Up for Automotive SoC Research Initiative

As automobiles get more complex, the "Advanced SoC Research for Automotive" (ASRA) initiative teams up a dozen automotive, electrical, and semiconductor companies to further develop automotive SoCs.


News Jan 05, 2024 by Duane Benson
Vehicle Networking Startup Ethernovia Secures $64 Million Funding

Vehicle Networking Startup Ethernovia Secures $64 Million Funding

As validation of its technology, Ethernovia recently raised a large sum in its A-round financing.


News May 26, 2023 by Jake Hertz
Revolutionizing Autonomy: The Latest Technologies Advancing ADAS

Revolutionizing Autonomy: The Latest Technologies Advancing ADAS

There's a lot at play for advanced driver assistance systems to monitor for drowsiness or connect vehicles to the grid. Here are a few recent technologies driving forward the future of autonomous vehicles.


News Apr 28, 2023 by Darshil Patel
SiTime Unveils Precision Timing ICs to Meet In-Car Connectivity Needs

SiTime Unveils Precision Timing ICs to Meet In-Car Connectivity Needs

With car designs getting ever more advanced, timing ICs are playing a big role. SiTime’s new devices aim to meet the special challenges of automotive timing.


News Apr 22, 2023 by Jeff Child
Targeting Automotive, Infineon Spins Industry’s First LPDDR Flash Memory

Targeting Automotive, Infineon Spins Industry’s First LPDDR Flash Memory

To meet the new demands of automotive zonal architectures, Infineon marries flash memory with an LPDDR interface to enable more performance and scalability than xSPI NOR flash.


News Apr 20, 2023 by Jeff Child
Qualcomm Snapdragon SoC Marries Infotainment and ADAS Support

Qualcomm Snapdragon SoC Marries Infotainment and ADAS Support

Building out its automotive portfolio, Qualcomm hopes its new SoC can enable the future of intelligent vehicles.


News Jan 10, 2023 by Jake Hertz
NXP Unwraps One-chip Automotive Radar SoC Based on 28 nm RF CMOS

NXP Unwraps One-chip Automotive Radar SoC Based on 28 nm RF CMOS

Claiming the industry’s first 28 nm RF CMOS one-chip radar IC, NXP hopes to enable a 360-degree safety cocoon of radar sensing in cars.


News Jan 09, 2023 by Jeff Child
Startup Validates its MEMS Scanning Mirror Process for LiDARs

Startup Validates its MEMS Scanning Mirror Process for LiDARs

Setting out to overcome the drawbacks of today’s LiDAR mirror alternatives, Omnitron Sensors has crafted a 3D MEMS technology fit for low-cost, high-volume markets.


News Nov 30, 2022 by Jeff Child
Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.


News Aug 16, 2022 by Jeff Child