As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.
5 days ago by Nicholas St. John
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.
October 05, 2020 by Jake Hertz
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.
October 02, 2020 by Luke James
Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.
September 30, 2020 by Adrian Gibbons
Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.
September 21, 2020 by Adrian Gibbons
With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.
September 15, 2020 by Antonio Anzaldua Jr.
Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.
September 12, 2020 by Jake Hertz
Texas researchers realize the strengths of both solid-state and liquid-state batteries in the first room-temperature liquid-metal battery.
August 29, 2020 by Luke James
The SuperFin is an enhanced FinFET combined with a super MIM capacitor and an interconnect metal stack. What doors will this 10nm transistor open?
August 19, 2020 by Rushi Patel
The new chip leverages photonic topological insulators to operate in the terahertz band—not in the 5G range, but in the 6G range.
August 10, 2020 by Jake Hertz
The two RF powerhouses have teamed up to create a flexible radio platform that addresses 5G network design challenges.
August 05, 2020 by Jake Hertz
Pliops has announced its storage processor, which they claim increases flash performance by 10 times and improves cost and performance by 90%.
July 31, 2020 by Jake Hertz
New research has unveiled new phase-change materials, touted as having ultra-low losses and little power consumption. How might this finding affect telecommunications?
July 28, 2020 by Rushi Patel
The usable RF spectrum is a finite resource, and, with enough simultaneous users, congestion can become a serious impediment to reliable communication.
July 24, 2020 by Jake Hertz
Regarded the father of modern electronics, John Ambrose Flemings created the first vacuum tube while also providing some helpful educational tips now used in engineering education.
July 18, 2020 by Vanessa Samuel
How are ground-penetrating radars forging exploration in space exploration, archeology, explosive detection? It turns out, this technology can be quite versatile.
July 10, 2020 by Kayla Matthews
The relatively new semiconductor—spin-gapless semiconductors—bridges zero‐gap materials and half‐metals while having spin-polarized electrons and holes.
July 08, 2020 by Antonio Anzaldua Jr.
A new connectivity protocol shows promise for IoT designs, rivaling LoRaWAN and NB-IoT.
July 07, 2020 by Tyler Charboneau
Researchers from ETH Zürich have successfully combined photonic and electronic elements onto the same chip for the first time. The implications? A brighter future for optical communication networks.
July 07, 2020 by Jake Hertz
The most power-hungry component in RF transmitters, the RF power amplifier, is getting some serious attention from design engineers.
July 01, 2020 by Jake Hertz
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