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Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.


News Jun 15, 2026 by Duane Benson
Onsemi Unveils Interactive Web Tool to Simplify Power Design

Onsemi Unveils Interactive Web Tool to Simplify Power Design

The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.


News Jun 12, 2026 by Jeff Child
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Siemens Intros AI-Powered Library Characterizer to Speed IC Design

Siemens Intros AI-Powered Library Characterizer to Speed IC Design

New characterization software delivers 7x throughput gains by combining a predictive AI engine with a purpose-built SPICE simulator.


News Jun 02, 2026 by Luke James
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz