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With a New Factory on the Way, Nano Dimension Pushes for Widespread 3D-printed PCBs

Multi-layer PCBs are known for saving size and weight. Now, 3D printing these boards may be an option for more designers on a large scale.

February 02, 2022 by Lianne Frith

Altium Unveils the First “Design With Manufacturing” Platform

Announced at AltiumLive, the new Altimade application brings designers, supply chain experts, and manufacturers all on the same continuous digital thread.

January 27, 2022 by Jake Hertz

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.

October 14, 2021 by Jake Hertz

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?

June 25, 2021 by Jake Hertz

The Evolution of SPICE Continues With PSPICE for TI

The new PSPICE for TI enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.

September 17, 2020 by Jake Hertz

What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

Getting an end-of-life notice on a component can be a major setback for both new and existing designs. How do you work around the inconvenience?

June 15, 2020 by Nicholas St. John

Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

A new project indicates the value of 3D printing in PCB design: fast prototyping.

May 22, 2020 by Gary Elinoff

Printed Circuit Boards Receive an AI Boost Through Fraunhofer’s Modular Platform

The AI platform from the Fraunhofer Institute for Applied Information Technology (FIT) is comprised of modules for artificial intelligence, machine learning, and deep learning.

May 06, 2020 by Luke James

7 Collaborative PCB Software Programs for Designers Working Remotely

Social distancing doesn't mean your productivity must come to a halt.

April 01, 2020 by Kayla Matthews

What 3D-Printed CurveBoards Offer for Circuit Design Testing

MIT has developed a software design kit that speeds up electronic device development and prototyping by creating curved breadboards with pinholes and connections mapped out automatically.

March 06, 2020 by Luke James

Magnetic Assembly: A New Option for Delicate 3D Integration?

Pick-and-place can damage sensitive parts and contactless methods are inefficient for high volumes. What about magnetic assembly?

March 04, 2020 by Robin Mitchell

The Curiously Low-tech Side of High-tech Manufacturing

In this article, engineers discuss seemingly primitive parts of the manufacturing process and the feasibility of replacing those processes with automation.

February 08, 2020 by Ingrid Fadelli

“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.

January 29, 2020 by Robin Mitchell

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.

August 29, 2019 by Gary Elinoff

New App Tool for Augmented Reality PCB Design Enters Beta

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.

July 22, 2019 by Mark Hughes

Engineer Spotlight: MacroFab Co-Founder Parker Dillmann Explains PCB Design Trends

AAC recently spoke with Parker Dillmann, lead EE and co-founder of MacroFab, a PCB manufacturing company that aims to take some of the old-school pain out of the product development and scaling processes.

June 12, 2018 by Justin Kirkham

Hardware-in-the-Loop Simulation and Power System Design: An Interview with Dr. Sudipta Chakraborty

Sudipta Chakraborty is the Director of Energy Systems at OPAL-RT. In this Engineer Spotlight, he speaks about challenges facing power system design, how hardware-in-the-loop simulations are important for problem-solving with grid integration, and his work on the IEEE-1547 standard for power grid test procedures.

April 18, 2018 by Chantelle Dubois

DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

The Defense Advanced Research Projects Agency (DARPA) recently announced six additions to its Electronic Resurgence Initiative (ERI), using the talents (and funding) of the US military to solve issues that practicing designers see coming in the industry.

September 25, 2017 by Chantelle Dubois

Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

AJP promises to revolutionize 3D printing in the IoT era.

September 03, 2017 by Heather Hamilton-Post