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Altium Unveils the First “Design With Manufacturing” Platform

Altium Unveils the First “Design With Manufacturing” Platform

Announced at AltiumLive, the new Altimade application brings designers, supply chain experts, and manufacturers all on the same continuous digital thread.


News Jan 27, 2022 by Jake Hertz
Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.


News Oct 14, 2021 by Jake Hertz
Entering the Era of AI IC Design: Where Do EEs Fit In?

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?


News Jun 25, 2021 by Jake Hertz
The Evolution of SPICE Continues With PSPICE for TI

The Evolution of SPICE Continues With PSPICE for TI

The new PSPICE for TI enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.


News Sep 17, 2020 by Jake Hertz
What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

Getting an end-of-life notice on a component can be a major setback for both new and existing designs. How do you work around the inconvenience?


News Jun 15, 2020 by Nicholas St. John
Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

A new project indicates the value of 3D printing in PCB design: fast prototyping.


News May 22, 2020 by Gary Elinoff
Printed Circuit Boards Receive an AI Boost Through Fraunhofer’s Modular Platform

Printed Circuit Boards Receive an AI Boost Through Fraunhofer’s Modular Platform

The AI platform from the Fraunhofer Institute for Applied Information Technology (FIT) is comprised of modules for artificial intelligence, machine learning, and deep learning.


News May 06, 2020 by Luke James
7 Collaborative PCB Software Programs for Designers Working Remotely

7 Collaborative PCB Software Programs for Designers Working Remotely

Social distancing doesn't mean your productivity must come to a halt.


News Apr 01, 2020 by Kayla Matthews
What 3D-Printed CurveBoards Offer for Circuit Design Testing

What 3D-Printed CurveBoards Offer for Circuit Design Testing

MIT has developed a software design kit that speeds up electronic device development and prototyping by creating curved breadboards with pinholes and connections mapped out automatically.


News Mar 06, 2020 by Luke James
Magnetic Assembly: A New Option for Delicate 3D Integration?

Magnetic Assembly: A New Option for Delicate 3D Integration?

Pick-and-place can damage sensitive parts and contactless methods are inefficient for high volumes. What about magnetic assembly?


News Mar 04, 2020 by Robin Mitchell
The Curiously Low-tech Side of High-tech Manufacturing

The Curiously Low-tech Side of High-tech Manufacturing

In this article, engineers discuss seemingly primitive parts of the manufacturing process and the feasibility of replacing those processes with automation.


News Feb 08, 2020 by Ingrid Fadelli
“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.


News Jan 29, 2020 by Robin Mitchell
TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.


News Aug 29, 2019 by Gary Elinoff
New App Tool for Augmented Reality PCB Design Enters Beta

New App Tool for Augmented Reality PCB Design Enters Beta

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.


News Jul 22, 2019 by Mark Hughes
Engineer Spotlight: MacroFab Co-Founder Parker Dillmann Explains PCB Design Trends

Engineer Spotlight: MacroFab Co-Founder Parker Dillmann Explains PCB Design Trends

AAC recently spoke with Parker Dillmann, lead EE and co-founder of MacroFab, a PCB manufacturing company that aims to take some of the old-school pain out of the product development and scaling processes.


News Jun 12, 2018 by Justin Kirkham
Hardware-in-the-Loop Simulation and Power System Design: An Interview with Dr. Sudipta Chakraborty

Hardware-in-the-Loop Simulation and Power System Design: An Interview with Dr. Sudipta Chakraborty

Sudipta Chakraborty is the Director of Energy Systems at OPAL-RT. In this Engineer Spotlight, he speaks about challenges facing power system design, how hardware-in-the-loop simulations are important for problem-solving with grid integration, and his work on the IEEE-1547 standard for power grid test procedures.


News Apr 18, 2018 by Chantelle Dubois
DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

The Defense Advanced Research Projects Agency (DARPA) recently announced six additions to its Electronic Resurgence Initiative (ERI), using the talents (and funding) of the US military to solve issues that practicing designers see coming in the industry.


News Sep 25, 2017 by Chantelle Dubois
Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

AJP promises to revolutionize 3D printing in the IoT era.