Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds…
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring…
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver…
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.
The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.
The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh…
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs…
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.
Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution…
Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a…
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference…
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
In this exclusive CES interview, All About Circuits learned how EMASS's new ultra-low-power SoC brings intelligence where…
In this exclusive CES interview, All About Circuits learned how EMASS's new ultra-low-power SoC brings intelligence where size, power, and latency matter most: the sensor edge.
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