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Toshiba Employs Cortex-M4 MCUs With Motor PWM for Small System Control

Toshiba Employs Cortex-M4 MCUs With Motor PWM for Small System Control

The three TXZ+ entry-class M4H Group devices pair a 120-MHz Cortex-M4F with a +/-1% internal oscillator and an A-PMD motor-control block for 5-V consumer and industrial designs.


News 2 hours ago by Luke James
Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Infineon Wi-Fi 7 technology enables smart home with seamless interoperability, advanced environmental sensing, and energy-efficient connectivity.


News About 17 hours ago by Infineon Technologies
Summit 2026 - Next-Gen Edge AI: Building Intelligent Vision Systems with PSOC™ Edge

Summit 2026 - Next-Gen Edge AI: Building Intelligent Vision Systems with PSOC™ Edge

Discover how enhanced neural processing and memory simplify system development to deliver low-latency, power-efficient intelligence at the edge without cloud reliance.


News About 19 hours ago by Infineon Technologies
Summit 2026 - Collecting Data for Your Edge AI Project: From Vision to Sensor Fusion

Summit 2026 - Collecting Data for Your Edge AI Project: From Vision to Sensor Fusion

Demystify collecting high-quality data from sensors using DEEPCRAFT™ Studio! This presentation equips you to gather data and get AI models running on the edge.


News About 20 hours ago by Infineon Technologies
Microchip Forays Into Capacitive Touch Controllers for Buttons & Sliders

Microchip Forays Into Capacitive Touch Controllers for Buttons & Sliders

The MTCH3380P and MTCH3240P sample up to 12 sensor channels at once, which Microchip says keeps response fast on interfaces with up to 64 sensors.


News Oct 27, 2026 by Jake Hertz
Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Join us as we break down the humanoid system to examine key connectivity challenges and design approaches across vision, control, power distribution, and movement.


News Oct 21, 2026 by TE Connectivity
Summit 2026 - Beyond 2D: Robotic Environmental Awareness with 3D ToF and RGB Sensor Fusion

Summit 2026 - Beyond 2D: Robotic Environmental Awareness with 3D ToF and RGB Sensor Fusion

Join Infineon and pmdtechnologies for a demo-driven webinar on combining precise distance data with rich texture to elevate performance, reliability, and ROI.


Summit 2026 - Advanced Position Sensing Solution For Humanoid Robots

Summit 2026 - Advanced Position Sensing Solution For Humanoid Robots

Infineon’s XENSIV™ Hall sensors enable precise motor control and tactile sensing in hands. Learn key design requirements and engineering challenges for stable, reliable robotic motion.


Summit 2026 - Beyond Piezo: The Future of Ultrasound with XENSIV™ MEMS Ultrasonic Transceiver

Summit 2026 - Beyond Piezo: The Future of Ultrasound with XENSIV™ MEMS Ultrasonic Transceiver

XENSIV™ MEMS transceivers enable smaller, more integrated, and highly scalable sensing solutions. Learn key design considerations and emerging use cases across robotics and automation.


Summit 2026 Keynote - Intelligence with Consequences: Developing Physical AI for a Better World

Summit 2026 Keynote - Intelligence with Consequences: Developing Physical AI for a Better World

Renesas UX leader Ivo Marocco explores physical AI and intelligence at the edge. He details how autonomous systems and humanoid robots must be developed responsibly, safely, and efficiently.


News Oct 21, 2026 by Renesas Electronics
xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

Announced today, the company's new PiezoMEMS air movers reach subsystems that conventional fans and cold plates can’t.


News Oct 20, 2026 by Jake Hertz
Summit 2026 - Precision Timing: The Silent Dependency in High-Reliability Systems

Summit 2026 - Precision Timing: The Silent Dependency in High-Reliability Systems

Timing failures rarely announce themselves. They usually surface as system instability. Join us for a look at how SiTime's precision timing solutions keep that dependency silent for decades.


News Oct 14, 2026 by Dale Wilson
Summit 2026 - The Advantages of Reverberation Chambers for Automotive EMC Testing

Summit 2026 - The Advantages of Reverberation Chambers for Automotive EMC Testing

EMC testing is getting more complex. Discover how reverberation chambers deliver fast, repeatable, energy-efficient stress testing for autonomous, connected, electrified vehicles.


News Oct 14, 2026 by Rohde & Schwarz
Summit 2026 - Optimizing Silicon MOSFET Performance in High-Frequency DC-DC Converters

Summit 2026 - Optimizing Silicon MOSFET Performance in High-Frequency DC-DC Converters

Explore MOSFET tradeoffs in high-frequency DC-DC converters through 65 W HFQR and 204 W quarter-brick designs with experts from iDEAL Semiconductor.


News Oct 14, 2026 by Dale Wilson
Summit 2026 - Industrial Connectivity: Applications Driving the Next Wave of Growth

Summit 2026 - Industrial Connectivity: Applications Driving the Next Wave of Growth

Join experts from Molex to explore how industrial connectivity supports reliable power, signal, and data solutions as connected operations expand beyond the factory floor.


News Oct 14, 2026 by Molex Incorporated
Summit 2026 - Infineon Automotive Smart Power Stages: An Overview

Summit 2026 - Infineon Automotive Smart Power Stages: An Overview

Explore how DrMOS devices enable multiphase buck topologies. See an 8-phase core rail demo using Infineon Smart Power Stage TLF12505A for steady-state and dynamic response to load transients.


Summit 2026 Keynote - Betting Against the Bandgap: Reinventing Silicon Power Devices

Summit 2026 Keynote - Betting Against the Bandgap: Reinventing Silicon Power Devices

iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in power electronics and leverage silicon's infrastructure lead.


News Oct 14, 2026 by Dale Wilson
Ambarella Debuts Standalone AI Accelerator for Physical AI Designs

Ambarella Debuts Standalone AI Accelerator for Physical AI Designs

The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of the company’s AI SoCs.


News Oct 12, 2026 by Luke James
Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficiency targets.


News Oct 07, 2026 by Dale Wilson
Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.


News Oct 07, 2026 by Dale Wilson