The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to…
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to simplify brushless motor designs in battery-powered equipment.
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network…
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
Recent advances in photonics may boost the performance of LiDAR sensors, increase the resolution of image projection, and…
Recent advances in photonics may boost the performance of LiDAR sensors, increase the resolution of image projection, and integrate energy harvesting and light emission into a single display.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Paired with compact smart power stages, the new digital multiphase controllers may extend notebook battery life by up to an hour.
Paired with compact smart power stages, the new digital multiphase controllers may extend notebook battery life by up to an hour.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to…
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at…
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs…
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.
The new CMOS op amps combine low offset voltage, low noise, and 10-V/μs slew rate for flexible precision design.
The new CMOS op amps combine low offset voltage, low noise, and 10-V/μs slew rate for flexible precision design.
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