In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
3 days ago by Ingrid Fadelli
ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.
February 28, 2024 by Jake Hertz
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
February 26, 2024 by Jake Hertz
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
February 23, 2024 by Aaron Carman
The new hardware-assisted verification and validation system marks a first for the EDA industry.
February 21, 2024 by Jake Hertz
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
February 20, 2024 by Nthatisi Hlapisi
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
February 15, 2024 by Duane Benson
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
January 31, 2024 by Jake Hertz
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
January 20, 2024 by Jake Hertz
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
January 19, 2024 by Aaron Carman
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.
January 18, 2024 by Jake Hertz
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
January 17, 2024 by Duane Benson
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.
January 15, 2024 by Aaron Carman
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.
January 13, 2024 by Jake Hertz
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
January 09, 2024 by Duane Benson
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
December 27, 2023 by Jeff Child
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
December 22, 2023 by Aaron Carman
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores, marking the biggest architectural change since the 80286.
December 19, 2023 by Duane Benson
Based on the Arm Cortex-M85 processor, Renesas' RA8D1 provides high-performance graphics and security for consumer, medical, and industrial applications.
December 18, 2023 by Arjun Nijhawan
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
December 15, 2023 by Duane Benson
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