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Cypress Semi Announces USB-C Controllers to Shrink Design Footprint of USB-Enabled Devices

Cypress Semiconductor recently announced its latest USB-C controllers that are designed to improve next-generation PCs and notebooks.

March 22, 2020 by Luke James

New Motor-Driver ICs Beg the Question, What On Earth Are FREDFETs?

The new BridgeSwitch motor drivers from Power Integrations stand out for several reasons, like its package and system monitoring. But what do we make of their fundamental label as "FREDFETs?"

March 16, 2020 by Robert Keim

The Inner Workings of 3D Authentication in Qualcomm’s 5G Smartphones

A new reference design based on Qualcomm’s Snapdragon 865 targets Infineon's time-of-flight sensor as the star of the show.

March 10, 2020 by Gary Elinoff

How “ChipDNA” Levels Up Authenticator ICs

Maxim Integrated has cracked to more secure authentification—without a digital key stored in the IC’s memory.

March 07, 2020 by Robert Keim

TI’s New Buck Converter and the Issue of Switching Regulator Conduction Modes

The buck converter operates in "forced continuous conduction mode (FCCM)." Let's break that term down.

March 06, 2020 by Robert Keim

E-Waste: The Seedy Underbelly of PCB Disposal

Over a decade past the first alarm bells of the effects of electronic and electrical waste, e-waste is still a major blight in the electronics industry.

March 03, 2020 by Lisa Boneta

New Wireless Charging Platforms Bypass the Conundrum of Perfectly-Aligned Coils

Apple ultimately canceled its wireless power program because of coil alignment. Three new platforms aim to work around the problem that slowed the tech giant down.

March 02, 2020 by Kayla Matthews

ON Semiconductor Introduces Adaptive Charging Controller for USB PD 3.0

The FAN6390MPX incorporates an autonomous USB PD state machine to comply with the USB PD 3.0 specification.

March 02, 2020 by Gary Elinoff

NXP Announces Crossover MCU Family for Edge Device Voice Recognition

The i.MX RT600 family combines ultra-low power with small size for voice-based machine learning applications.

February 25, 2020 by Gary Elinoff

A New Device Out of UMass Amherst Powers Small Electronics from Moisture in the Air

Researchers have developed a device that creates energy from moisture in the air. Using a natural protein, Air-gen connects electrodes with nanowires, forming a transfer pathway for electricity.

February 24, 2020 by Tyler Charboneau

Eta Compute Start-Up Goes Commercial With SNNs Developed AI Chips

Eta Compute made headlines in 2018 with its neural networks that train themselves, and now the company has come to market with its AI chips that aim to provide AI to “edge” devices such as IoT sensors, battery-powered cameras, and more.

February 21, 2020 by Luke James

Diodes Incorporated Designs USB 3.2-Compliant ReDrivers to Enhance 10 Gbps Interfaces

The two-port PI3EQX1004E and the one-port PI3EQX1002E are said to be 64% smaller than competitive devices.

February 21, 2020 by Gary Elinoff

Laser Li-Fi May Far Outpace 5G Communications

Replacing radio waves with laser light – ‘Li-Fi’ – could soon be used to boost the speed and reach of communications far beyond the limits promised by 5G.

February 13, 2020 by Luke James

Three SoCs Compete for Processing Supremacy in New Smartphones

In this article, we'll take a closer look at recently available smartphone chips and how these chips are responding to higher demands of processing and memory.

February 11, 2020 by Lisa Boneta

Diodes Incorporated Releases New MOSFET Driver for Synchronous Rectification

The APR348 supports secondary-side output voltages up to 20 V in QR, CCM, and DCM flyback modes.

February 10, 2020 by Gary Elinoff

The UK Moves Forward with 5G and Huawei but Limits Equipment to Non-Critical Applications

The UK government is to allow Chinese tech giant Huawei to play a limited role in supplying the country’s 5G networks.

February 08, 2020 by Luke James

Micron Makes Way for 5G with Fifth Gen of DDR DRAM, Bumping Data Access Speed by 50%

Micron says their LPDDR5 DRAM will allow 5G smartphones to have 6.4 Gbps peak processing while improving power efficiency by 20%.

February 07, 2020 by Gary Elinoff

THine Designs Differential Transceiver IC for 4 Gbps of Digital Communication

The THCS251 IC aggregates 37 data signals into two differential pairs for full-duplex communications.

February 05, 2020 by Gary Elinoff

USB Type-C Power Density Controller from Diodes Incorporated Built for Quick Chargers

The AP43771 features low standby power and an embedded MCU with one-time programmable memory.

February 03, 2020 by Gary Elinoff

Four Up-and-Coming Semiconductor Start-ups are Sparking Innovation

In this article, we will take a look at a few up-and-comers and discuss their promise in the silicon industry.

January 31, 2020 by Robin Mitchell