New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF…
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection…
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs…
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's…
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to…
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to simplify brushless motor designs in battery-powered equipment.
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network…
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
Recent advances in photonics may boost the performance of LiDAR sensors, increase the resolution of image projection, and…
Recent advances in photonics may boost the performance of LiDAR sensors, increase the resolution of image projection, and integrate energy harvesting and light emission into a single display.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Paired with compact smart power stages, the new digital multiphase controllers may extend notebook battery life by up to an hour.
Paired with compact smart power stages, the new digital multiphase controllers may extend notebook battery life by up to an hour.
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