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A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

Single-digit node process is nothing new, but existing technology hampers RF performance due to parasitics. Samsung Foundry and TSMC seek to bring single-digit node performance to RF chips.

one day ago by Adrian Gibbons

Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Today, Mipsology is announcing its solution for FPGA programming: Zebra FPGA IP. This IP aims to ease FPGA programming, giving the designer more time to design.

June 09, 2021 by Sam Holland

“Smart” Power Lines? ST’s SoC and RF Chipset Get Industry-first Certification

The G3-PLC hybrid standard ensures interoperability and is key to STMicroelectronics delivering competitive market solutions for power line communications.

June 03, 2021 by Adrian Gibbons

NXP is Revving Up ADAS Technology with 16 nm FinFET Processors

Recently, AAC had the chance to sit down with Matthias Feulner and Brian Carlson from NXP to hear about two new automotive processors on 16nm technology.

June 02, 2021 by Jake Hertz

Concrete Batteries: Cementing a New Foundation for Energy Storage?

In a newly published paper, researchers from Chalmers University describe how they were able to turn cement into a medium for electrical energy storage.

May 28, 2021 by Jake Hertz

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.

May 21, 2021 by Jake Hertz

Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Intel veteran Uri Frank has been hired by Google as its new VP of engineering for server chip design. What does this mean for Google's custom silicon?

March 24, 2021 by Jake Hertz

AMD Says Its “Highest-performing Server Processor” Is Here

Designed to level up with burgeoning data center demands, AMD claims its new EPYC 7003 Series CPUs outperform competitors in terms of speed and security.

March 16, 2021 by Jake Hertz

What Will It Take to Make 6G a Reality by 2030? A Theoretical Conversation

From telepresence holograms to machines as the network's primary users, 6G will be very different from today's network. But does the hardware for this network even exist?

March 15, 2021 by Adrian Gibbons

Women’s History Month Spotlight: Edith Clarke, the First Female Electrical Engineer

Edith Clarke not only revolutionized electrical power system analysis; she also blazed a trail for women in electrical engineering.

March 13, 2021 by Hannah DeTavis

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

Emerging DDR5 Technology Shows Promise in Securing Automotive Memory

While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.

March 02, 2021 by Antonio Anzaldua Jr.

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.

March 02, 2021 by Jake Hertz

New Automotive SoCs Provide a Window to ADAS Trends

Taking a survey of new automotive-facing chips can tip us off to the design trends ADAS may take in the future.

February 16, 2021 by Jake Hertz

New Switch Families Aim to Break Down Complicated Network Infrastructure Walls

Microchip is seeking to cut through the fog of network complexity with two new families—one family of Ethernet switches and one family of PCIe 5.0 switches.

February 05, 2021 by Jake Hertz

As mmWave Tech Matures, T&M Equipment and Techniques are Shifting, Too

While millimeter wave technology is by no means new, test and measurement suppliers are releasing innovative tips and equipment to help test engineers address higher-frequency challenges.

January 29, 2021 by Antonio Anzaldua Jr.

Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.

January 27, 2021 by Jake Hertz

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.

January 25, 2021 by Adrian Gibbons

The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The CES 2021 stage has debuted the hardware of some of the first Wi-Fi 6E devices. What are the benefits and challenges of this new connectivity protocol?

January 15, 2021 by Tyler Charboneau

More Cells, More Range: TI’s Wireless Battery Management System Frees EV Space for More Design Innovation

We spoke with Texas Instruments to learn more about this new tech, which they feel can shake up the EV industry.

January 07, 2021 by Jake Hertz