The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.
September 09, 2021 by Jake Hertz
Hoping to take the "edge" off of data center workloads comes two new additions to Semtech's Tri-Edge family. What are they and how do they help data centers keep up through data center interconnects?
September 03, 2021 by Antonio Anzaldua Jr.
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
July 15, 2021 by Adrian Gibbons
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
July 14, 2021 by Adrian Gibbons