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Seco Launches Industrial HMI and SBC Powered by Qualcomm’s New Processor

Seco Launches Industrial HMI and SBC Powered by Qualcomm’s New Processor

The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.


News Sep 18, 2026 by Luke James
Nanopower’s Sensor Monitoring IC Saves Power on Always-On Devices

Nanopower’s Sensor Monitoring IC Saves Power on Always-On Devices

Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle current of just 200 nA.


News Sep 17, 2026 by Joshua Tidwell
Onsemi Unveils Platform That Turns  Silicon Wafers Into Power Packages

Onsemi Unveils Platform That Turns Silicon Wafers Into Power Packages

By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.


News Sep 16, 2026 by Jeff Child
Qualcomm Splits One IoT Quad-Core Die Across Consumer and Industrial Lines

Qualcomm Splits One IoT Quad-Core Die Across Consumer and Industrial Lines

The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.


News Sep 10, 2026 by Luke James
Arm Rolls AI-Native Compute Platforms for Edge, Physical, and Cloud Systems

Arm Rolls AI-Native Compute Platforms for Edge, Physical, and Cloud Systems

Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.


News Sep 07, 2026 by Jeff Child
Targeting Robotics, TI Claims First Commercial CAN XL Transceiver

Targeting Robotics, TI Claims First Commercial CAN XL Transceiver

Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD compatibility for industrial and robotic networks.


News Sep 04, 2026 by Joshua Tidwell
Paragraf Launches 12-Channel Graphene FET Platform and Real-Time Reader

Paragraf Launches 12-Channel Graphene FET Platform and Real-Time Reader

The PMF2002 multiplexes 12 customer-functionalized graphene sensing channels on one device, while the new Enterprise Reader adds direct electronic readout and real-time analysis.


News Sep 04, 2026 by Luke James
NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.


News Aug 25, 2026 by Jeff Child
Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.


News Aug 24, 2026 by Duane Benson
Three Research Teams Take Different Routes to Control Light

Three Research Teams Take Different Routes to Control Light

Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and component footprint.


News Aug 20, 2026 by Luke James
 Murata, TDK, and Knowles Raise Capacitor Expectations With New Lineups

Murata, TDK, and Knowles Raise Capacitor Expectations With New Lineups

The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety qualifications for automotive and industrial applications.


News Aug 19, 2026 by Joshua Tidwell
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Intel 14A Design Ecosystem Gains Support from Major EDA Partners

Intel 14A Design Ecosystem Gains Support from Major EDA Partners

Siemens, Cadence, Synopsys, and Keysight have certified new design tools, reference flows, IP, and simulation support for Intel 14A.


News Aug 13, 2026 by Austin Futrell
Vox Power Unveils Digitally Enabled Output Modules and Open-Source DevKit

Vox Power Unveils Digitally Enabled Output Modules and Open-Source DevKit

This set of PMBus-compatible output modules and an accompanying digital development kit streamline the control, monitoring, and integration of high-density configurable power supplies.


News Aug 07, 2026 by Jeff Child
Microchip’s Industrial Midspan Unlocks PoE for Legacy Networks

Microchip’s Industrial Midspan Unlocks PoE for Legacy Networks

The PoE solution injects IEEE 802.3bt power onto existing Ethernet runs and operates from -40°C to 75°C, targeting factory and outdoor deployments where switch upgrades are impractical.


News Aug 04, 2026 by Luke James
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
MEMS Sensors Measure Pressures as Low as 2 Bar in Gas and Liquid

MEMS Sensors Measure Pressures as Low as 2 Bar in Gas and Liquid

Melexis has added low-pressure variants with analog, LIN, and SENT output options to its Triphibian pressure sensor family.


News Jul 30, 2026 by Jake Hertz
Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

New HBM, UFS, NAND, and EEPROM devices span the storage stack.


News Jul 24, 2026 by Jake Hertz
MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.


News Jul 22, 2026 by Luke James