The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
This 4th-generation IC family minimizes no-load consumption and simplifies safety compliance for consumer and industrial…
This 4th-generation IC family minimizes no-load consumption and simplifies safety compliance for consumer and industrial AC-DC power supplies without increasing design complexity.
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive…
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive power circuits, and high-temperature operation.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U…
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U rack-mount instrument.
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive…
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive compliance testing, and advanced AI semiconductor testing.
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control,…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle…
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle current of just 200 nA.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD…
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD compatibility for industrial and robotic networks.
The PMF2002 multiplexes 12 customer-functionalized graphene sensing channels on one device, while the new Enterprise…
The PMF2002 multiplexes 12 customer-functionalized graphene sensing channels on one device, while the new Enterprise Reader adds direct electronic readout and real-time analysis.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and…
Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and component footprint.
The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety…
The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety qualifications for automotive and industrial applications.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
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