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Tektronix Intros Wideband Shunts and High Voltage Differential Probe

Tektronix Intros Wideband Shunts and High Voltage Differential Probe

The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision low-current analysis to high voltage power validation.


News 19 hours ago by Austin Futrell
3 Pocket-Sized Photonics Innovations Power MedTech to Atomic Clocks

3 Pocket-Sized Photonics Innovations Power MedTech to Atomic Clocks

Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.


News Jun 22, 2026 by Luke James
ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
Onsemi Unveils Interactive Web Tool to Simplify Power Design

Onsemi Unveils Interactive Web Tool to Simplify Power Design

The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.


News Jun 12, 2026 by Jeff Child
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
SPI Connectivity Comes to STMicroelectronics’ New Gate Drivers

SPI Connectivity Comes to STMicroelectronics’ New Gate Drivers

The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to simplify brushless motor designs in battery-powered equipment.


News Jun 08, 2026 by Austin Futrell
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.


News May 29, 2026 by Joshua Tidwell
Microchip’s 100/1000BASE‑T1 SPE PHYs Pack Security and Safety Features

Microchip’s 100/1000BASE‑T1 SPE PHYs Pack Security and Safety Features

The new 100/1000BASE-T1 transceiver families integrate IEEE 802.1AE-2018 frame security and TSN, targeting ADAS, zonal architectures, and industrial automation.


News May 20, 2026 by Luke James
New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact high-current interconnects, and environmentally sealed USB Type-C connectivity.


News May 13, 2026 by Joshua Tidwell
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

The dual operational amplifier offers 20-µV precision across a wide 36-V supply range, eliminating the need for complex compensation in industrial and automotive signal chains.


News May 01, 2026 by Jake Hertz
Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.


News Apr 29, 2026 by Luke James
Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

The configurable logic block microcontrollers grant developers the flexibility of an MCU-based design with the deterministic capability of dedicated hardware.


News Apr 28, 2026 by Duane Benson
Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Two new product families pair Pragmatic's PR1301 chip with paper antennas to push smart packaging beyond silicon RFID's cost and material floor.


News Apr 27, 2026 by Luke James
More Control, Less Chaos With Microchip’s New All-in-One DSCs

More Control, Less Chaos With Microchip’s New All-in-One DSCs

Microchip’s new digital signal controllers integrate high-resolution control, high-speed analog, and post-quantum cryptography.


News Apr 24, 2026 by Joshua Tidwell
New Semtech IC Closes the USB-PD VBus Protection Gap at 53 V

New Semtech IC Closes the USB-PD VBus Protection Gap at 53 V

Where conventional TVS diodes fall short, the new circuit protection device offers continuous clamping voltage across current and temperature conditions.


News Apr 21, 2026 by Austin Futrell
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller