Join this webinar to discover how Infineon's pressure sensors enable early thermal runaway detection and improve battery safety through fast, reliable pressure…
Join this webinar to discover how Infineon's pressure sensors enable early thermal runaway detection and improve battery safety through fast, reliable pressure monitoring.
iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in…
iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in power electronics and leverage silicon's infrastructure lead.
The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.
The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.
The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of…
The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of the company’s AI SoCs.
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free…
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
This 4th-generation IC family minimizes no-load consumption and simplifies safety compliance for consumer and industrial…
This 4th-generation IC family minimizes no-load consumption and simplifies safety compliance for consumer and industrial AC-DC power supplies without increasing design complexity.
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive…
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive power circuits, and high-temperature operation.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U…
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U rack-mount instrument.
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive…
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive compliance testing, and advanced AI semiconductor testing.
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control,…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle…
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle current of just 200 nA.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD…
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD compatibility for industrial and robotic networks.
The PMF2002 multiplexes 12 customer-functionalized graphene sensing channels on one device, while the new Enterprise…
The PMF2002 multiplexes 12 customer-functionalized graphene sensing channels on one device, while the new Enterprise Reader adds direct electronic readout and real-time analysis.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
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