Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.
5 days ago by Duane Benson
In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.
February 27, 2024 by Duane Benson
The company’s UFS 4.0 solution meets AEC-Q100 Grade 2 requirements.
February 01, 2024 by Jake Hertz
Rambus' latest registering clock driver inches DDR5 memory closer to data center-level performance.
January 02, 2024 by Aaron Carman
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
December 22, 2023 by Aaron Carman
At this year's Flash Memory Summit, two companies combined their respective cooling technology and SSD controllers to unlock unprecedented storage performance.
August 29, 2023 by Aaron Carman
Here are three announcements from the 2023 Flash Memory Summit that reflect some of the biggest trends in memory and storage technology.
August 18, 2023 by Jake Hertz
Micron aims to strike a balance of high bandwidth, power efficiency, and speed with its latest generation of high-bandwidth memory (HBM3) technology.
July 31, 2023 by Aaron Carman
Rising to meet the automotive sector’s need for a long memory lifetime and fast data logging, Infineon has introduced two new FRAM devices.
July 20, 2023 by Jake Hertz
The team has claimed to solve a common problem in conventional resistive switching memories by introducing a chemical element: barium.
June 30, 2023 by Jake Hertz
Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).
May 31, 2023 by Jake Hertz
Neo Semiconductor has unveiled the so-called world's first NAND-like DRAM for memory-intensive applications.
May 11, 2023 by Darshil Patel
With new capital, Weebit Nano is poised to continue development of ReRAM for improved memory technology.
May 02, 2023 by Aaron Carman
To meet the new demands of automotive zonal architectures, Infineon marries flash memory with an LPDDR interface to enable more performance and scalability than xSPI NOR flash.
April 20, 2023 by Jeff Child
At Embedded World this week, AMD has unveiled its 4th-gen EPYX Embedded processors. The chips offer energy efficiency along with some embedded-specific features.
March 15, 2023 by Jeff Child
The new cloud-based version includes a GitHub-based model resource, and remote access to a “board farm” to remotely benchmark edge-AI models on STM32 MCU boards.
January 31, 2023 by Jeff Child
75 years ago, the transistor was born. Its invention launched modern electronics as it moved from the building block of ICs, then microprocessors, and beyond.
December 23, 2022 by Jeff Child
At IEDM 2022, Intel tipped its ambitions to build a processor comprising one trillion transistors by 2030.
December 12, 2022 by Chantelle Dubois
MCU vendors continue to up their game. Latest chips serve up neural processing for the edge, innovations in on-chip non-volatile memory, and tech for secure biometric card payments.
December 10, 2022 by Jeff Child
For the 35th anniversary of the invention of flash memory, here is a commemoration of the Father of Flash.
December 02, 2022 by Chantelle Dubois
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