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Skyworks’ PA Geared to Support 5G Signals With Wide Instantaneous Bandwidth

The SKY66318-11 features a wide instantaneous bandwidth for 100MHz systems, which is said to enable higher data rates for 4G LTE and 5G signals.

one day ago by Lisa Boneta

NIC Components’ SMT Power Inductors Built to Operate Up to +155°C

The NPIM_PE series are automotive-grade metal composite SMT power inductors with an operating temperature range of ‐55°C to +155°C.

one day ago by Cabe Atwell

Nexperia Enters the Gallium Nitride FET Arena

Nexperia's newly announced GAN063-650WSA is a 650-volt gallium nitride power FET featuring an RDS(on) of 60 mΩ.

one day ago by Gary Elinoff

ST Highlights New Temperature Sensors’ Accuracy—to Within 0.25°C

The STTS22H from STMicroelectronics typically draws 0.5 µA in standby mode.

2 days ago by Gary Elinoff

Analog Devices Reveals a Low-power PHY Chip for the Industrial Ethernet

The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.

November 13, 2019 by Gary Elinoff

GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.

November 11, 2019 by Gary Elinoff

Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.

November 08, 2019 by Gary Elinoff

Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.

November 07, 2019 by Gary Elinoff

Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.

November 04, 2019 by Robin Mitchell

Diodes Incorporated Releases Buck Converter Family Designed to Combat EMI

Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.

October 31, 2019 by Gary Elinoff

New ARM IP Brings Down Costs of AI for Mainstream Products

Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.

October 28, 2019 by Gary Elinoff

Diodes Incorporated Reveals 2A Load Switch Aimed to Improve High-Side Load Switch Reliability

The AP22913 features slew-rate control and true reverse-current blocking for single-channel load switching.

October 25, 2019 by Gary Elinoff

Microchip Claims to Have Solved Power Over Ethernet Interoperability Issues with New PoE Products

New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.

October 24, 2019 by Gary Elinoff

X-FABs Adds NVM to Its 180nm BCD-on-SOI Platform

Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.

October 18, 2019 by Gary Elinoff

ROHM’s New Family of 4-Pin Trench-Gate SiC MOSFETs Aims to Reduce Switching Losses

The SCT3xxx xR series, available in 650V and 1200V VDS versions, can reduce switching losses by up to 35%.

October 11, 2019 by Gary Elinoff

IoT Roundup: New Wireless Protocols Extend Coverage and Memory

As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.

October 10, 2019 by Hannah DeTavis

Littelfuse Releases New TVS Diode Arrays for Protecting High-Speed Data Lines

The new SP3384NUTG series is designed to shield 10GbE differential data lines from transient electrical hazards.

October 02, 2019 by Gary Elinoff

TI Introduces Four New Buck-Boost Converters Aimed for Battery-Powered Designs

A new family of low-quiescent-current buck-boost devices delivers up to 2.5 A in a compact footprint.

October 01, 2019 by Gary Elinoff

Cree Invests $1 Billion in Silicon Carbide Fabrication Facilities

Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon carbide device manufacturing facility in the world.

September 26, 2019 by Gary Elinoff

TI’s Newest LDO Linear Voltage Regulator Boasts Sub-25 nA IQ for Power-Sensitive Applications

Texas Instruments’ TPS7A02 low-dropout linear regulator combines ultra-low IQ with fast transient response.

September 23, 2019 by Gary Elinoff