Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power…
Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power Bluetooth Mesh sensing.
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall…
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless…
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.
The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.
The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection…
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
The compact system footprint and streamlined integration may help automakers adapt to shifting radio policies.
The compact system footprint and streamlined integration may help automakers adapt to shifting radio policies.
The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.
The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
The company's new, first-of-its-kind test software platform leverages AI to replace lengthy custom hardware or FPGA development.
The company's new, first-of-its-kind test software platform leverages AI to replace lengthy custom hardware or FPGA development.
The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale…
The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.
The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of…
The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide…
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector…
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering…
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
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