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Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.

5 days ago by Luke James

How Ethernet Switches are Branching Into Industries Far Beyond IT

While Ethernet switches were once solely associated with IT applications, today they are staples in industries from military to rail communications.

November 25, 2020 by Luke James

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.

November 13, 2020 by Antonio Anzaldua Jr.

Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."

October 31, 2020 by Luke James

Maxim Doubles Down on Factory Automation With IO-Link Chips and Reference Design

In modernized factories, time efficiency is paramount. New designs from Maxim Integrated aim to streamline efficiency by using configurable digital and analog IO.

October 28, 2020 by Jake Hertz

NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.

October 02, 2020 by Luke James

Molded Interconnect Devices May Be a PCB’s Partner in Design

Molded interconnect devices, when conditioned with laser direct imaging, could be a helpful 3D supplement to PCB design.

September 16, 2020 by Adrian Gibbons

When Cold Chain Reliability Comes Down to a Single Degree, a Precise Temperature Sensor IC Counts

There are many different types of temperature sensors. But one type is specially equipped to handle the precision and scalability of cold chain management.

September 09, 2020 by Jake Hertz

TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

At the company’s very first online symposium, TSMC showcased a range of new technologies, including its N4 process, which is scheduled to come online in late 2021.

August 26, 2020 by Luke James

How Suppliers and Designers Can Prepare for a Supply Chain Comeback

The pandemic dealt a sizable blow to the semiconductor industry. Here's how the rebound might look.

August 26, 2020 by Kayla Matthews

Digi-Key Broadens Access to Products with New Marketplace Initiative

Digi-Key says its Marketplace platform gives engineers access to millions of products from a variety of suppliers—all on one website.

August 18, 2020 by Luke James

Inspired by Coffee Rings, Cambridge Researchers Create Ink for Next-Gen Printed Electronics

When inkjet droplets dry in a "coffee stain" pattern, printed electronic devices can malfunction. A new formula spreads evenly to eliminate the issue.

August 17, 2020 by Antonio Anzaldua Jr.

From Laser to Workbench: New Tech Speeds Up PCB Solder Mask Production

A new laser direct imaging technology may significantly increase the speed of solder mask production at a low cost.

August 10, 2020 by Jake Hertz

Image Sensor Roundup: Toshiba, Sony, and Samsung Zero In on Industrial and Smartphone Applications

These new devices are forging innovation in image sensor technology—speeding up industrial equipment, doubling up on pixels, and capturing both visible and invisible light.

July 24, 2020 by Nicholas St. John

Radiation Plus Electronics is a Bad Combo. Enter a New Rad-Hard Manufacturing Method

Space radiation can wreak havoc on electronic devices. While there are many ways to prevent damage, MIT's newly-developed manufacturing technique using rad-hard CMOS technology shows promise.

July 13, 2020 by Jake Hertz

What the CHIPS for America Act Could Mean for the U.S. Semiconductor Industry

The bill would secure $22 billion to promote more U.S.-based semiconductor manufacturing.

June 24, 2020 by Tyler Charboneau

ADI Makes Big Swing for Industry 4.0 with First Software-Configurable Industrial I/Os

Two new I/O solutions bring remote programmability to building control and industrial automation.

May 29, 2020 by Gary Elinoff

TSMC Responds to Pressure for US-Based Fab, Announces Plans for $12 Billion Chip Factory in Arizona

Responding to the US government's request for more US chip factories earlier this week, TSMC has announced plans to cash out $12 billion for a fab house in Arizona.

May 15, 2020 by Hannah DeTavis

US Government Approaches the Big Three—TSMC, Intel, Samsung—to Build US Chip Factories

Intel enthusiastically agreed; TSMC—not so much.

May 12, 2020 by Gary Elinoff

‘Superfast’ New Ceramic Manufacturing Method Could Lead to AI-Driven Materials Design

Scientists at the University of Maryland are said to have reinvented a 26,000-year-old manufacturing process into an innovative approach to fabricating ceramic materials for applications that include AI-driven materials design.

May 07, 2020 by Luke James