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Why Are Semiconductor Fabs Dotting Arizona, the “Silicon Desert?”

Forget Silicon Valley—here’s how Arizona could become the "Silicon Desert" with more semiconductor titans considering the move.

February 24, 2021 by Luke James

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

February 22, 2021 by Luke James

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

February 17, 2021 by Luke James

New PMOS Devices Take a Note on the Low On-Resistance of NMOS

Many current P-channel MOSFETs don't cut it for high-voltage applications. To meet the challenge, a new family of PMOS is claimed to feature 62% lower RDS(on) than comparable devices.

February 12, 2021 by Jake Hertz

From Labs to Fabs: New Manufacturing Method Shows Promise in Scaling Quantum Computing

Using transistors as qubits, researchers have achieved single-electron operation in foundry-fabricated silicon—a potential breakthrough in quantum computing manufacturing.

January 20, 2021 by Jake Hertz

Integrated Laser-on-Silicon Photonics Gets a Boost from DARPA

Partially funded by DARPA, Tower Semiconductor is creating a new foundry process for integrated-laser-on-silicon photonics.

January 12, 2021 by Luke James

Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021

The U.S. government has made big pushes for domestic chip manufacturing in 2020. What does this trajectory look like for 2021?

December 30, 2020 by Luke James

A New Manufacturing Method May Pull Nanowires From the Research Realm to Market

Nanowires are seeing drastic advances in academia, emphasizing the promise that they offer the optoelectronics industry.

December 30, 2020 by Jake Hertz

Figures of Merit in Power Design: A Reliable Benchmark or an Evolving Standard?

Design teams, especially in the power sector, may be increasingly asked to benchmark performance with Figures of Merit. What is this standard and how might it be evolving alongside component innovation?

December 04, 2020 by Antonio Anzaldua Jr.

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.

November 28, 2020 by Luke James

How Ethernet Switches are Branching Into Industries Far Beyond IT

While Ethernet switches were once solely associated with IT applications, today they are staples in industries from military to rail communications.

November 25, 2020 by Luke James

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.

November 13, 2020 by Antonio Anzaldua Jr.

Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."

October 31, 2020 by Luke James

Maxim Doubles Down on Factory Automation With IO-Link Chips and Reference Design

In modernized factories, time efficiency is paramount. New designs from Maxim Integrated aim to streamline efficiency by using configurable digital and analog IO.

October 28, 2020 by Jake Hertz

NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.

October 02, 2020 by Luke James

Molded Interconnect Devices May Be a PCB’s Partner in Design

Molded interconnect devices, when conditioned with laser direct imaging, could be a helpful 3D supplement to PCB design.

September 16, 2020 by Adrian Gibbons

When Cold Chain Reliability Comes Down to a Single Degree, a Precise Temperature Sensor IC Counts

There are many different types of temperature sensors. But one type is specially equipped to handle the precision and scalability of cold chain management.

September 09, 2020 by Jake Hertz

TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

At the company’s very first online symposium, TSMC showcased a range of new technologies, including its N4 process, which is scheduled to come online in late 2021.

August 26, 2020 by Luke James

How Suppliers and Designers Can Prepare for a Supply Chain Comeback

The pandemic dealt a sizable blow to the semiconductor industry. Here's how the rebound might look.

August 26, 2020 by Kayla Matthews

Digi-Key Broadens Access to Products with New Marketplace Initiative

Digi-Key says its Marketplace platform gives engineers access to millions of products from a variety of suppliers—all on one website.

August 18, 2020 by Luke James