Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
3 days ago by Adrian Gibbons
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to catch up on this cloud-focused technology.
May 03, 2021 by Antonio Anzaldua Jr.
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their new AT25EU NOR Flash to answer the call.
April 30, 2021 by Adrian Gibbons
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous AI workloads.
April 16, 2021 by Tyler Charboneau
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are still hard at work developing better memory technology for enhanced compute potential.
April 08, 2021 by Adrian Gibbons
Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research projects are taking on the challenge.
April 05, 2021 by Jake Hertz
With mounting data demands, Samsung has unveiled a new DDR5 module with HKMG process technology to accommodate AI, ML, and supercomputing applications.
April 02, 2021 by Antonio Anzaldua Jr.
Micron has announced the sale of its Utah chip factory as it ceases production of a once "revolutionary" memory chip developed in partnership with Intel.
March 23, 2021 by Luke James
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.
March 02, 2021 by Antonio Anzaldua Jr.
Researchers at MIT have created an algorithm-based architecture called SpAtten that reduces attention computation and memory access in natural language processing (NLP) systems.
February 16, 2021 by Antonio Anzaldua Jr.
Renesas recently released 12 new MCUs for IoT and industrial use cases—the key focal point being its wakeup time, along with high performance, low power, and enhanced security.
February 04, 2021 by Jake Hertz
Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.
January 27, 2021 by Jake Hertz
Keeping with the trend to depart from von Neumann architectures, French researchers have overcome non-ideal properties of memristors to bring Bayesian networks to the edge.
January 23, 2021 by Jake Hertz
In 2020, many companies released flagship low-power devices with the goal of bringing AI to the edge. We’ll review some of the most recent ones and see how they compare.
December 28, 2020 by Jake Hertz
Despite the pandemic, 2020 was a monumental year for space exploration. And pivotal to each mission's success at the circuit level was radiation-hardened memory devices.
December 21, 2020 by Tyler Charboneau
According to IC Insights, DRAM was the biggest IC product category for 2020 with sales of $65.2 billion, followed by NAND coming in second at $55.2 billion.
December 10, 2020 by Luke James
Can analog computation be a viable solution to the many challenges facing edge AI hardware? We spoke with Mike Henry, CEO of Mythic, to see why they think it is.
December 02, 2020 by Jake Hertz
New research has unveiled that it’s possible to switch states of magnetism between ON and OFF in a new class of easy-to-fabricate materials containing nitrogen.
November 26, 2020 by Luke James
In what the company has described as a breakthrough in flash memory, performance, and density, Micron has shipped the world’s first 176-layer 3D NAND.
November 17, 2020 by Luke James
With the demand for in-memory computation increasing, Xilinx and Samsung have set out to create a “one size fits all” solution.
November 13, 2020 by Jake Hertz
Don't have an AAC account? Create one now.
Forgot your password? Click here.
