By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market,…
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech,…
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
Fresh from a $17.5M Series A, RAAAM’s novel embedded memory tech aims to reshape SoC design, pushing beyond the…
Fresh from a $17.5M Series A, RAAAM’s novel embedded memory tech aims to reshape SoC design, pushing beyond the SRAM-DRAM tradeoff.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
In 1975, the 2708 became the first EPROM that engineers could practically socket into 8-bit systems, if they could power it.
In 1975, the 2708 became the first EPROM that engineers could practically socket into 8-bit systems, if they could power it.
A new memristor architecture trades silicon for shiitake, advancing low-power neuromorphic hardware with biodegradable substrates.
A new memristor architecture trades silicon for shiitake, advancing low-power neuromorphic hardware with biodegradable substrates.
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular…
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular framework and configuration tool unification.
Are you a first year electronics engineering student? Or maybe working on a second or third degree in this field? All…
Are you a first year electronics engineering student? Or maybe working on a second or third degree in this field? All About Circuits has the resources you need: comprehensive textbooks, technical articles, calculators, videos, and more for your EE studies.
In 1970, Intel’s 1103 became the first commercially successful DRAM chip, and the first time a semiconductor memory…
In 1970, Intel’s 1103 became the first commercially successful DRAM chip, and the first time a semiconductor memory beat magnetic core at its own game: price, density, and logic-level compatibility.
The new series targets CPU-attached NVMe deployments with disaggregated architecture and hardware offload.
The new series targets CPU-attached NVMe deployments with disaggregated architecture and hardware offload.
The memory modules combine high-speed performance, compact layouts, and tool-free modularity for reliable edge AI…
The memory modules combine high-speed performance, compact layouts, and tool-free modularity for reliable edge AI operation in tough environments.
Kioxia says its UFS version 4.1 embedded flash memory device can improve performance and diagnostic capabilities in…
Kioxia says its UFS version 4.1 embedded flash memory device can improve performance and diagnostic capabilities in automotive and data center applications.
The company claims the new 16-GB DDR4 model is the highest density space-grade DDR4 memory on the market.
The company claims the new 16-GB DDR4 model is the highest density space-grade DDR4 memory on the market.
Micron’s new SSD portfolio delivers faster speeds, more capacity, and better energy efficiency for AI workloads.
Micron’s new SSD portfolio delivers faster speeds, more capacity, and better energy efficiency for AI workloads.
Enfabrica's new Ethernet-based AI memory fabric system drops AI inference cost per user per token by up to 50%.
Enfabrica's new Ethernet-based AI memory fabric system drops AI inference cost per user per token by up to 50%.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
The new solution arrives in tandem with JEDEC’s LPDDR6 standard to provide higher bandwidth and efficiency for AI workloads.
The new solution arrives in tandem with JEDEC’s LPDDR6 standard to provide higher bandwidth and efficiency for AI workloads.
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