Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution…
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities…
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.
Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.
Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.
Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
The new SSD, which leverages a PCIe Gen5 interface, may redefine data transfer speeds and reliability for AI PC OEMs.
The new SSD, which leverages a PCIe Gen5 interface, may redefine data transfer speeds and reliability for AI PC OEMs.
Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be…
Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be achieved by transistor scaling alone.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
A new memory technology has been sweeping the industry and bringing substantial performance gains with it.
A new memory technology has been sweeping the industry and bringing substantial performance gains with it.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current…
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Startups are using and supporting AI in a myriad of ways.
Startups are using and supporting AI in a myriad of ways.
At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the…
At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded…
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded Future of Memory Storage show.
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against…
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.
New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.
New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
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