Micron’s new SSD portfolio delivers faster speeds, more capacity, and better energy efficiency for AI workloads.
Micron’s new SSD portfolio delivers faster speeds, more capacity, and better energy efficiency for AI workloads.
Enfabrica's new Ethernet-based AI memory fabric system drops AI inference cost per user per token by up to 50%.
Enfabrica's new Ethernet-based AI memory fabric system drops AI inference cost per user per token by up to 50%.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
The new solution arrives in tandem with JEDEC’s LPDDR6 standard to provide higher bandwidth and efficiency for AI workloads.
The new solution arrives in tandem with JEDEC’s LPDDR6 standard to provide higher bandwidth and efficiency for AI workloads.
Micron claims the new SSD one-ups TLC value drives in user experience while maintaining QLC economics.
Micron claims the new SSD one-ups TLC value drives in user experience while maintaining QLC economics.
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and…
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution…
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities…
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.
Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.
Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.
Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
The new SSD, which leverages a PCIe Gen5 interface, may redefine data transfer speeds and reliability for AI PC OEMs.
The new SSD, which leverages a PCIe Gen5 interface, may redefine data transfer speeds and reliability for AI PC OEMs.
Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be…
Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be achieved by transistor scaling alone.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
A new memory technology has been sweeping the industry and bringing substantial performance gains with it.
A new memory technology has been sweeping the industry and bringing substantial performance gains with it.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current…
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.
Facebook
Google
GitHub
Linkedin