Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Startups are using and supporting AI in a myriad of ways.
Startups are using and supporting AI in a myriad of ways.
At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the…
At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded…
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded Future of Memory Storage show.
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against…
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.
New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.
New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.
Weebit Nano and Efabless are teaming up to make it easier for chip designers to prototype intelligent devices using…
Weebit Nano and Efabless are teaming up to make it easier for chip designers to prototype intelligent devices using Weebit's advanced memory technology.
The new Pascari brand will provide SSDs for data-heavy enterprise applications.
The new Pascari brand will provide SSDs for data-heavy enterprise applications.
Dr. Robert Dennard passed away last month. He dedicated more than half a century of his professional life to…
Dr. Robert Dennard passed away last month. He dedicated more than half a century of his professional life to microelectronics research, resulting in pivotal MOSFET scaling equations and DRAM.
From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize…
From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize density and speed.
Today's processors support large-language models scaling to over a trillion parameters. Rambus is keeping up with this…
Today's processors support large-language models scaling to over a trillion parameters. Rambus is keeping up with this computational load with a new memory solution.
Micron simplifies data access in new vehicle architectures with its first multi-port automotive SSD.
Micron simplifies data access in new vehicle architectures with its first multi-port automotive SSD.
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional…
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.
Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.
Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.
In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a…
In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.
During his long and remarkably productive career, Jay Forrester accumulated an impressive list of innovations and…
During his long and remarkably productive career, Jay Forrester accumulated an impressive list of innovations and achievements in electrical engineering, social science, and business management.
The company’s UFS 4.0 solution meets AEC-Q100 Grade 2 requirements.
The company’s UFS 4.0 solution meets AEC-Q100 Grade 2 requirements.
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
Rambus' latest registering clock driver inches DDR5 memory closer to data center-level performance.
Rambus' latest registering clock driver inches DDR5 memory closer to data center-level performance.
Facebook
Google
GitHub
Linkedin