Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network…
At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.
The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.
The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.
The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the…
The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to…
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.
The new Akida Cloud is developed for instant access to the company's innovations and reduced development cycles.
The new Akida Cloud is developed for instant access to the company's innovations and reduced development cycles.
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center,…
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center, networking, and communications timing system.
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed…
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed routing tight and efficient.
On this New Years Day, we share 2025 predictions from leading companies in our industry.
On this New Years Day, we share 2025 predictions from leading companies in our industry.
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative…
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.
Startups are using and supporting AI in a myriad of ways.
Startups are using and supporting AI in a myriad of ways.
The new EDA tool supports the industry’s growing transition toward 3D integrated circuits.
The new EDA tool supports the industry’s growing transition toward 3D integrated circuits.
Armed with key functions available in separate blocks, designers can get a headstart on PCIe Gen 7 with Synopsys’s newest IP.
Armed with key functions available in separate blocks, designers can get a headstart on PCIe Gen 7 with Synopsys’s newest IP.
Embedded World was rife with major hardware releases. Here are a few unique software packages designed to simplify the…
Embedded World was rife with major hardware releases. Here are a few unique software packages designed to simplify the development experience.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
The new NPUs offload from any host processor to facilitate on-device edge computing.
The new NPUs offload from any host processor to facilitate on-device edge computing.
EDA tools now employ the newest advances in AI to help designers accelerate the IC development process.
EDA tools now employ the newest advances in AI to help designers accelerate the IC development process.
The latest CR-8000 release expands the design software's spectrum of signal integrity, power integrity, and…
The latest CR-8000 release expands the design software's spectrum of signal integrity, power integrity, and electromagnetic compatibility analysis tools.
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