The new development kit helps designers create industrial systems incorporating actuators and sensors.
The new development kit helps designers create industrial systems incorporating actuators and sensors.
In a recent report, IDTechEx defined the who, what, and when of sustainable IC and PCB manufacturing.
In a recent report, IDTechEx defined the who, what, and when of sustainable IC and PCB manufacturing.
As we enter 2025, the semiconductor industry is at a crossroads of ongoing innovation and lurking uncertainty.
As we enter 2025, the semiconductor industry is at a crossroads of ongoing innovation and lurking uncertainty.
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative…
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.
Bourns’ new products meet next-gen needs for signal transmission, high-current sensing, and surge protection.
Bourns’ new products meet next-gen needs for signal transmission, high-current sensing, and surge protection.
Heinz Joseph Gerber escaped from a Nazi labor camp to become one of the most prolific U.S. inventors of the 20th century.
Heinz Joseph Gerber escaped from a Nazi labor camp to become one of the most prolific U.S. inventors of the 20th century.
Littelfuse built the new solid-state relay family to meet the rigorous reliability requirements of commercial and…
Littelfuse built the new solid-state relay family to meet the rigorous reliability requirements of commercial and industrial machinery.
The humble universal product code has passed the 50-year mark as a key tool in the retail sales industry.
The humble universal product code has passed the 50-year mark as a key tool in the retail sales industry.
At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes…
At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.
Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S.…
Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S. semiconductor supply chain.
With TSMC scaling down to 2 nm and lower, the semiconductor giant is working with Cadence, Siemens, and Synopsys to bring…
With TSMC scaling down to 2 nm and lower, the semiconductor giant is working with Cadence, Siemens, and Synopsys to bring updated EDA tools to IC designers.
Intel and ASML collaborated on the high NA EUV lithography tools to pioneer the next generation of chips.
Intel and ASML collaborated on the high NA EUV lithography tools to pioneer the next generation of chips.
Rohm has teamed up with Quanmatics to deploy quantum technology in a large-scale semiconductor manufacturing facility for…
Rohm has teamed up with Quanmatics to deploy quantum technology in a large-scale semiconductor manufacturing facility for the first time.
The new program from the USPTO aims to jump-start research, development, and investment in the domestic semiconductor industry.
The new program from the USPTO aims to jump-start research, development, and investment in the domestic semiconductor industry.
The new family supports a wide range of frequencies, modulation schemes, and deep sleep modes.
The new family supports a wide range of frequencies, modulation schemes, and deep sleep modes.
With a fresh injection of funds from the European Chips Act, Germany is vying to stabilize the European semiconductor…
With a fresh injection of funds from the European Chips Act, Germany is vying to stabilize the European semiconductor industry within its borders.
Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the…
Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the world, it now faces an unprecedented challenge.
The company hopes to decrease its carbon footprint with a biodegradable FR-4 alternative.
The company hopes to decrease its carbon footprint with a biodegradable FR-4 alternative.
At DAC this week, Siemens is rolling out an IC design tool suite that it claims enables “correct-by-construction”…
At DAC this week, Siemens is rolling out an IC design tool suite that it claims enables “correct-by-construction” design changes earlier in the cycle.
Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those…
Intel has pledged 33 billion euros to expand its semiconductor presence across Europe. Here's what the breakdown of those funds looks like.
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