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Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

The new CMOS op amps combine low offset voltage, low noise, and 10-V/μs slew rate for flexible precision design.


News Apr 09, 2026 by Joshua Tidwell
Maxlinear Adds Serial Transceivers for Harsh Industrial Applications

Maxlinear Adds Serial Transceivers for Harsh Industrial Applications

The new serial transceivers deliver up to 50 Mbps transfer speeds and advanced ESD and EFT protection in noisy industrial environments.


News Apr 08, 2026 by Duane Benson
U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.


News Mar 26, 2026 by Luke James
STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.


News Mar 23, 2026 by Jake Hertz
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.


News Mar 05, 2026 by Luke James
Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

The new family of opto-emulator gate drivers provides drop-in replacements to conventional silicon, IGBT, and SiC MOSFET designs.


News Mar 04, 2026 by Charles Lee
NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs.


News Feb 23, 2026 by Luke James
Microchip’s New MCU: A 32-bit Upgrade That Still Fits Old 8-bit Systems

Microchip’s New MCU: A 32-bit Upgrade That Still Fits Old 8-bit Systems

Microchip’s PIC32CM PL10 MCUs combine 32-bit Cortex-M0+ performance with AVR pin compatibility, MVIO, and functional safety support.


News Feb 19, 2026 by Joshua Tidwell
Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

The new linear sensor pushes the capture speed envelope for industrial machine vision.


News Feb 13, 2026 by Duane Benson
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.


News Feb 09, 2026 by Joshua Tidwell
Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.


News Feb 09, 2026 by Jeff Child
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller