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Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.


News Mar 05, 2026 by Luke James
Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

The new family of opto-emulator gate drivers provides drop-in replacements to conventional silicon, IGBT, and SiC MOSFET designs.


News Mar 04, 2026 by Charles Lee
NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs.


News Feb 23, 2026 by Luke James
Microchip’s New MCU: A 32-bit Upgrade That Still Fits Old 8-bit Systems

Microchip’s New MCU: A 32-bit Upgrade That Still Fits Old 8-bit Systems

Microchip’s PIC32CM PL10 MCUs combine 32-bit Cortex-M0+ performance with AVR pin compatibility, MVIO, and functional safety support.


News Feb 19, 2026 by Joshua Tidwell
Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

The new linear sensor pushes the capture speed envelope for industrial machine vision.


News Feb 13, 2026 by Duane Benson
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.


News Feb 09, 2026 by Joshua Tidwell
Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.


News Feb 09, 2026 by Jeff Child
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST says its new microprocessors balance application-class performance, real-time control, and power management.


News Feb 03, 2026 by Jake Hertz
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
Toshiba Intros High-Speed Comparator for Industrial Safety

Toshiba Intros High-Speed Comparator for Industrial Safety

Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for safer overcurrent detection.


News Jan 29, 2026 by Joshua Tidwell
Infineon Balances Power and Performance in USB 2.0 Peripheral Controller

Infineon Balances Power and Performance in USB 2.0 Peripheral Controller

Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip SRAM for high-throughput devices.


News Jan 28, 2026 by Joshua Tidwell
Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
For the First Time, AI Designs a Computer—in Less Than a Week

For the First Time, AI Designs a Computer—in Less Than a Week

Quilter has designed a fully functional Unix computer using AI, compressing a quarter's worth of PCB design time into a single week.


News Jan 14, 2026 by Arjun Nijhawan
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James