With 5G rolling out more quickly as we approach 2021, it may be helpful to touch on the key technologies that make 5G such a speedy success.
December 02, 2020 by John Koon
Voltage-level translators are essential in devices like SD/micro SD card readers, wireless access points, and 5G femtocells. How exactly do these devices work?
November 30, 2020 by Nicholas St. John
As modulation scheme efficiency goes up, power amplifier efficiency goes down. Xilinx, TI, and Skyworks are bringing their expertise to the table to reconcile the trade-off.
November 18, 2020 by Adrian Gibbons
Although 2020 has been one of the biggest years for mergers and acquisitions in the chip industry, global trade conflicts could slow deals from being finalized.
November 14, 2020 by Luke James
Advanced Micro Devices has agreed to buy rival Californian chipmaker Xilinx in a $35 billion all-stock deal, the latest in a wave of high-profile mergers and acquisitions currently sweeping the semiconductor industry.
October 27, 2020 by Luke James
Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to break all existing benchmarks.
October 27, 2020 by Adrian Gibbons
FETs and MOSFETs don't always cut it for dynamic applications. Nexperia says it has created a new flavor of FETs designed to rise to the challenge.
October 26, 2020 by Antonio Anzaldua Jr.
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.
October 26, 2020 by Steve Arar
With 5G closer than ever, it may be useful to brush up on the basics.
October 23, 2020 by John Koon
As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology: thermal management.
October 21, 2020 by Steve Arar
As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.
October 14, 2020 by Nicholas St. John
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.
October 05, 2020 by Jake Hertz
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.
October 02, 2020 by Luke James
Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.
September 30, 2020 by Adrian Gibbons
Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.
September 21, 2020 by Adrian Gibbons
With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.
September 15, 2020 by Antonio Anzaldua Jr.
Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.
September 12, 2020 by Jake Hertz
Texas researchers realize the strengths of both solid-state and liquid-state batteries in the first room-temperature liquid-metal battery.
August 29, 2020 by Luke James
The SuperFin is an enhanced FinFET combined with a super MIM capacitor and an interconnect metal stack. What doors will this 10nm transistor open?
August 19, 2020 by Rushi Patel
The new chip leverages photonic topological insulators to operate in the terahertz band—not in the 5G range, but in the 6G range.
August 10, 2020 by Jake Hertz
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