Congatec Leverages New COM and Cooling Solution to Beat the Edge AI Heat

Congatec, a leading provider of embedded and edge computing technology, announced two major projects at Embedded World 2025: the launch of its latest COM Express Compact module, the Conga-TC750, and an innovative heat pipe cooling solution designed for extreme environmental conditions.

Congatec’s Christof Wilde (left) and All About Circuits' editor-in-chief Jeff Child (right) at Embedded World 2025. 

Together, these products are expected to help enhance AI-driven computing and ensure performance stability in harsh environments. Christof Wilde, Congatec’s team leader of corporate marketing, discussed the potential impact of these products on the shifting AI landscape while speaking to All About Circuits' editor-in-chief, Jeff Child, at Embedded World.

The Conga-TC750 COM Express Compact Module

The Conga-TC750 is Congatec’s latest COM Express Compact Type 6 module, bringing unparalleled AI performance to industrial, medical, and embedded applications. At the heart of this new module are the Intel Core Ultra Series 2 processors (codenamed Arrow Lake), which feature a hybrid architecture with up to 16 cores and 22 threads.

One of the most notable capabilities of the Conga-TC750 is its AI acceleration, delivering up to 99 TOPS. This is a significant upgrade over previous generations, enabling more advanced AI inference at the edge, machine vision, and predictive maintenance applications. Congatec says this performance leap has been achieved through an Intel Xe-LPG+ integrated GPU, contributing 77 TOPS for high-throughput AI tasks and a neural processing unit that adds 13 TOPS for efficient deep learning inference. 

Congatec’s new TC750 COM Express module.

Memory and connectivity also get a boost, with the Conga-TC750 supporting up to 128 GB of DDR5 memory at 6,400 MT/s, along with USB4, PCIe Gen4/5, and 2.5 GbE networking with Time-Sensitive Networking (TSN) support. This ensures low-latency, real-time applications, making it useful for industrial automation and robotics.

"Medical has always been at the forefront of AI, from aided diagnostics to embedded vision applications,” Wilde said. “But now, industrial AI applications—such as predictive maintenance and quality control—are emerging as well.”

Innovative Heat Pipe Cooling for Extreme Conditions

Congatec's second announcement was a heat pipe cooling solution specifically designed for extreme environmental conditions. Unlike traditional cooling solutions, Congatec’s design uses acetone as a working fluid instead of water, preventing freezing in arctic environments and ensuring uninterrupted performance in temperatures as low as -40°C.

This cooling system is also mechanically resilient and resistant to shock and vibration, making it suitable for autonomous vehicles, logistics operations in ports and airports, and even rail and aviation applications. It pairs particularly well with high-performance COMs, such as the Conga-TC750 and Conga-TC675, ensuring sustained computing power in fanless, fully sealed designs.

A rendering of Congatec’s new heat pipe cooling solution.

Speaking about the need for advanced cooling, Wilde highlighted that modern processors are limited by thermal capacity rather than raw clock speeds.

"Performance capacity is mainly driven by cooling capacity in today’s processors,” Wilde said. “If you don’t have potent cooling, you’re not fully utilizing the processor’s capabilities."​

This solution also simplifies system integration by reducing the need for expensive, complex custom cooling systems. Instead, it allows for standardized cooling upgrades while maintaining cost-efficiency and reliability.

A Perfect Match for High-Performance Edge Computing?

The Conga-TC750 and Congatec’s heat pipe cooling solution are powerful companion products. The COM Express Compact module’s AI capabilities push edge computing performance to new heights, while the cooling system ensures that performance is sustained even in the harshest conditions.

This combination opens up new opportunities for AI-driven embedded computing, from medical imaging and industrial automation to autonomous systems operating in extreme climates. Congatec’s modular approach also makes upgrading to next-gen AI capabilities easier without requiring a complete system overhaul.

At Embedded World 2025, Congatec proved that performance and reliability don’t have to be trade-offs. With the Conga-TC750 and the new heat pipe cooling system, AI computing at the edge may be smarter, faster, and cooler.

All product images used courtesy of Congatec.