Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.
Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.
At the Enlit Europe energy forum in Paris, ST highlighted a Prime v1.4-certified chipset for smart metering and an NB-IoT…
At the Enlit Europe energy forum in Paris, ST highlighted a Prime v1.4-certified chipset for smart metering and an NB-IoT module for mobile devices.
At its annual Spectra conference, today Particle is rolling out hardware and software products aimed at making IoT more…
At its annual Spectra conference, today Particle is rolling out hardware and software products aimed at making IoT more accessible for all.
The new family of MPUs offers some unique architectural features for industrial applications.
The new family of MPUs offers some unique architectural features for industrial applications.
Providing a major bump to AI and industrial applications, Qualcomm’s latest processors bring more computing power to…
Providing a major bump to AI and industrial applications, Qualcomm’s latest processors bring more computing power to the network edge.
As Wi-Fi 6-enabled IoT devices proliferate into the billions, TI’s new Wi-Fi 6 companion chips are aimed at meeting the…
As Wi-Fi 6-enabled IoT devices proliferate into the billions, TI’s new Wi-Fi 6 companion chips are aimed at meeting the challenges associated with this crowded landscape.
At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at…
At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at automotive and industry radar systems.
Serving up low-power wireless connectivity, high-performance computing, and comprehensive development resources, this…
Serving up low-power wireless connectivity, high-performance computing, and comprehensive development resources, this batch of IoT modules, SoCs, and dev boards smooth the way for IoT system designers.
At CES today, NXP introduced its new i.MX 95 family. These application processors up the game for the 9 series in terms…
At CES today, NXP introduced its new i.MX 95 family. These application processors up the game for the 9 series in terms of 3D graphics, NPU functionality, and more.
In an effort to marry power efficiency with mid-range FPGA performance, the company has unveiled a new family of tiny…
In an effort to marry power efficiency with mid-range FPGA performance, the company has unveiled a new family of tiny form factor, low-power devices.
Putting its Ideal Switch technology back into action, Menlo Micro has unveiled what it says is the industry highest power…
Putting its Ideal Switch technology back into action, Menlo Micro has unveiled what it says is the industry highest power MEMS switch device.
Using its patented technology, onsemi has brought inductive position sensing into the high-speed, high-accuracy realm.…
Using its patented technology, onsemi has brought inductive position sensing into the high-speed, high-accuracy realm. The device enables easy-to-implement PCB sensor designs.
The latest Ethernet transceivers from Microchip leverage IEEE 1588v2 standards for precision timing protocols.
The latest Ethernet transceivers from Microchip leverage IEEE 1588v2 standards for precision timing protocols.
Multiple MCU vendors recently announced new software, platforms, and modules to ever expand the reach of wireless connectivity.
Multiple MCU vendors recently announced new software, platforms, and modules to ever expand the reach of wireless connectivity.
Setting out to enter the high-end processing niche within RISC-V, startup LeapFive has unveiled a quad-core 1.8 GHz RISC-V SoC.
Setting out to enter the high-end processing niche within RISC-V, startup LeapFive has unveiled a quad-core 1.8 GHz RISC-V SoC.
Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth…
Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.
At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal…
At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal IC verification tool adding new capabilities.
High expectations are placed on today’s microcontrollers (MCUs). To keep pace, MCU companies are beefing up peripheral…
High expectations are placed on today’s microcontrollers (MCUs). To keep pace, MCU companies are beefing up peripheral mixes and security, while some are even adding time-sensitive networking (TSN).
By moving location calculation to the cloud, Semtech’s new service allows for lower-power LoRa devices to be embedded…
By moving location calculation to the cloud, Semtech’s new service allows for lower-power LoRa devices to be embedded in tracked Internet of Things (IoT) assets.
Aimed at industrial IoT and vision systems, AMD’s new generation of its Ryzen Embedded R-Series SoCs, doubles core…
Aimed at industrial IoT and vision systems, AMD’s new generation of its Ryzen Embedded R-Series SoCs, doubles core count, links to four 4K displays, and includes Windows 11 support.
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