Keysight's new solution tackles LPDDR6 workflows for end-to-end memory design and testing.
Keysight's new solution tackles LPDDR6 workflows for end-to-end memory design and testing.
AI took center stage at CES 2025, with Intel showcasing its leadership through new Core and Core Ultra processors…
AI took center stage at CES 2025, with Intel showcasing its leadership through new Core and Core Ultra processors designed for AI-driven tasks.
This chip includes an All Big Core CPU architecture, a seven‑core graphics engine, a generative AI NPU, HDR imaging,…
This chip includes an All Big Core CPU architecture, a seven‑core graphics engine, a generative AI NPU, HDR imaging, and a 5G modem.
Merry Christmas! Never forget that our business is a people business. Enjoy this review of four of the trade shows All…
Merry Christmas! Never forget that our business is a people business. Enjoy this review of four of the trade shows All About Circuits attended this year, and the great people we met.
Qualcomm claims the new processor offers the mobile industry’s largest shared cache with record speeds for data retrieval.
Qualcomm claims the new processor offers the mobile industry’s largest shared cache with record speeds for data retrieval.
The company’s newest flagship SoC introduces architectural advances to bring performance and efficiency to the next…
The company’s newest flagship SoC introduces architectural advances to bring performance and efficiency to the next wave of AI-capable smartphones.
RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops.
RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops.
The OV50M40 sensor incorporates advanced features, including a stacked architecture, to deliver higher performance out of…
The OV50M40 sensor incorporates advanced features, including a stacked architecture, to deliver higher performance out of a smaller footprint.
Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart…
Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart performance to mobile devices.
Rohm designed the new 0.88 mm x 0.58 mm rail-to-rail op amp for devices where space is at a premium, such as smartphones…
Rohm designed the new 0.88 mm x 0.58 mm rail-to-rail op amp for devices where space is at a premium, such as smartphones and IoT devices.
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost…
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost phones worldwide.
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm…
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package
STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.
STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's…
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's “All-Big-Core” architecture.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI…
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL)…
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533…
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
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