Rohm designed the new 0.88 mm x 0.58 mm rail-to-rail op amp for devices where space is at a premium, such as smartphones and IoT devices.
Rohm designed the new 0.88 mm x 0.58 mm rail-to-rail op amp for devices where space is at a premium, such as smartphones and IoT devices.
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost…
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost phones worldwide.
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm…
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package
STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.
STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's…
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's “All-Big-Core” architecture.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI…
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL)…
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533…
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible…
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing…
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of…
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores,…
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores, marking the biggest architectural change since the 80286.
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and…
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and extend operating times for battery-powered devices and systems.
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