The RZ/G3L and RZ/G3SE share a pin-compatible package platform and 1-mW-level standby power.
The RZ/G3L and RZ/G3SE share a pin-compatible package platform and 1-mW-level standby power.
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to…
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to significantly speed reliable quantum application development.
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive…
New passive components from TDK, Vishay, Murata, and Bourns address higher capacitance, RF power handling, automotive power circuits, and high-temperature operation.
A new material uses physical structure and material mix to direct photons out and minimize losses from internal reflection.
A new material uses physical structure and material mix to direct photons out and minimize losses from internal reflection.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA…
The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple…
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple programming interface created the hobbyist MCU scene.
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U…
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U rack-mount instrument.
Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices…
Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices highlight growing investment in AI infrastructure, quantum manufacturing, optical connectivity, and edge intelligence.
Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density…
Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density bottlenecks in AI data center storage and molecular computing.
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring…
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring flagship AI performance to fanless Googlebooks.
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive…
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive compliance testing, and advanced AI semiconductor testing.
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and…
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and built-in peripherals for secure IoT and industrial system control.
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control,…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle…
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle current of just 200 nA.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end…
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development…
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.
The new members deliver fourth generation LoRa Plus IP-core compatible performance at less stringent tiers to complement…
The new members deliver fourth generation LoRa Plus IP-core compatible performance at less stringent tiers to complement flagship LR2021.
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