News

The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.

Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.

Power Integrations' AEC-Q100-qualified LQ10N200CQ and LQ20N200CQ diodes target automotive audio systems.

The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety....

A researcher has tested two competing IoT technologies, MYTHINGS and LoRa, against each other to see which one is more reliable. How did they do?...

NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.

The TI-RSLK Max allows students to gain hands-on experience building a robot and programming it.

The NCP1095 and NCP1096 deliver 90 Watts power-over-internet (POE) in compliance with IEEE's 802.3bt standard.

A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms....

The SPM-VT series meets the high thermal and current demands of the automotive LED headlight environment.

What's new in RF?

DARPA’s Subterranean (SubT) Challenge seeks to find new ways to cope with complex underground environments.

The new SiLabs units aim at the PLCs, relay drivers, and servo motor controllers employed in industrial automation.

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.

Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.

The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs....

From the typical pick-and-place down to the high-precision cobots, industrial robotics are changing rapidly.

Learn the different ways companies are using time-of-flight 3D sensor technology to create products for facial recognition, smart cars, and manufacturing....

This article looks at gallium arsenide, comparing it to other semiconductor materials, and explores how different compounds are used in components....