Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide…
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.
The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full…
The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.
In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional…
In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
Molex, TE Connectivity, and Samtec have introduced new connector platforms targeting next-generation automotive…
Molex, TE Connectivity, and Samtec have introduced new connector platforms targeting next-generation automotive networking, industrial electronics, and AI computing.
With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems…
With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.
Signetics packed a VCO and phase detector into one 14-pin part, turning a daunting feedback technique into something an…
Signetics packed a VCO and phase detector into one 14-pin part, turning a daunting feedback technique into something an ordinary engineer could build.
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector…
5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering…
Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.
The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a…
The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's…
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion…
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.
The new 8-GHz active differential probe and vector signal analysis software target PCIe, DDR, USB, Ethernet, Wi-Fi, LTE,…
The new 8-GHz active differential probe and vector signal analysis software target PCIe, DDR, USB, Ethernet, Wi-Fi, LTE, and 5G signal analysis.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
Four deals target edge AI hardware and software, data center cooling, and embedded development tools.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and…
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.
The PicoScope 5000E Series delivers a 22-µV RMS noise floor and up to 5-GS/s sampling in a USB-C-powered package.
The PicoScope 5000E Series delivers a 22-µV RMS noise floor and up to 5-GS/s sampling in a USB-C-powered package.
Facebook
Google
GitHub
Linkedin