The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for…
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.
The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut…
The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.
The family replaces cascaded switch architectures, reducing component count, improving signal integrity, and supporting…
The family replaces cascaded switch architectures, reducing component count, improving signal integrity, and supporting operation from 50 MHz to 10 GHz.
Cirrus Logic introduced nine new 32-bit ADCs, DACs, and codecs for pro and prosumer audio systems with 115 dB dynamic range.
Cirrus Logic introduced nine new 32-bit ADCs, DACs, and codecs for pro and prosumer audio systems with 115 dB dynamic range.
The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement…
The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision low-current analysis to high voltage power validation.
Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.
Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless…
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless technology to successfully reconnect the brain to paralyzed limbs.
Created by Philips and Mullard in 1963, the BC109 was the low-noise member of a transistor family that dominated European…
Created by Philips and Mullard in 1963, the BC109 was the low-noise member of a transistor family that dominated European electronics for two decades and later became a sought-after component in guitar effects.
Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing…
Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive…
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
The SoC brings on-sensor L2/L2+ perception processing to entry-level vehicle platforms using NXP's 28-nm RFCMOS architecture.
The SoC brings on-sensor L2/L2+ perception processing to entry-level vehicle platforms using NXP's 28-nm RFCMOS architecture.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds…
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
ST recently introduced the L9963F battery-management IC for EVs and energy storage systems with ASIL-D support and…
ST recently introduced the L9963F battery-management IC for EVs and energy storage systems with ASIL-D support and synchronized cell monitoring.
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