The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless…
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.
Rohm’s second-generation resonant tunneling diode oscillator reaches 40 µW maximum output in the same package as gen 1.
Rohm’s second-generation resonant tunneling diode oscillator reaches 40 µW maximum output in the same package as gen 1.
The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.
The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.
Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and…
Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and component footprint.
The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety…
The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety qualifications for automotive and industrial applications.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF…
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
Texas Instruments combined JFET inputs with a bipolar output stage in 1977—and it slowly took over guitar pedals,…
Texas Instruments combined JFET inputs with a bipolar output stage in 1977—and it slowly took over guitar pedals, synthesizers, and mixing desks.
Siemens, Cadence, Synopsys, and Keysight have certified new design tools, reference flows, IP, and simulation support for…
Siemens, Cadence, Synopsys, and Keysight have certified new design tools, reference flows, IP, and simulation support for Intel 14A.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection…
The new 2.2 A single-coil fan driver boasts code-free configuration, low-noise motor control, and integrated protection for GPU, data center, industrial, and appliance cooling applications.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.
Learners gain practical experience with industry-standard software through a self-paced curriculum covering schematic…
Learners gain practical experience with industry-standard software through a self-paced curriculum covering schematic capture, layout, and DFM verification
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
This set of PMBus-compatible output modules and an accompanying digital development kit streamline the control,…
This set of PMBus-compatible output modules and an accompanying digital development kit streamline the control, monitoring, and integration of high-density configurable power supplies.
The new gate driver pairs a truly differential input with onboard regulation and Miller Clamp protection to support both…
The new gate driver pairs a truly differential input with onboard regulation and Miller Clamp protection to support both GaN HEMTs and logic-level silicon FETs.
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