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Nvidia Unveils Seven Chips to ‘Scale the World’s Largest AI Factories’

Nvidia Unveils Seven Chips to ‘Scale the World’s Largest AI Factories’

The Vera Rubin platform offers a modular, rack-scale architecture to help develop and deploy agentic AI.


News Apr 13, 2026 by Jake Hertz
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
How Two Motorola Transistors Became the World’s Default NPNs

How Two Motorola Transistors Became the World’s Default NPNs

Registered by Motorola in 1962 and the mid-1960s, the 2N2222 and 2N3904 outlasted thousands of rivals through process innovation, cheap packaging, and a JEDEC numbering system that turned them into multi-sourced commodities.


News Apr 10, 2026 by Luke James
Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.


News Apr 09, 2026 by Luke James
Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

The new CMOS op amps combine low offset voltage, low noise, and 10-V/μs slew rate for flexible precision design.


News Apr 09, 2026 by Joshua Tidwell
Maxlinear Adds Serial Transceivers for Harsh Industrial Applications

Maxlinear Adds Serial Transceivers for Harsh Industrial Applications

The new serial transceivers deliver up to 50 Mbps transfer speeds and advanced ESD and EFT protection in noisy industrial environments.


News Apr 08, 2026 by Duane Benson
Siglent Launches 6.5 GHz Network Analyzer for R&D and Production Test

Siglent Launches 6.5 GHz Network Analyzer for R&D and Production Test

The SNA5000X-E packs S-parameter measurement, time-domain analysis, and eye diagram capability into a chassis weighing under 5.4 kg.


News Apr 07, 2026 by Luke James
EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
U-blox’s New Wi-Fi 6E Module Steps Up When the Airwaves Get Crowded

U-blox’s New Wi-Fi 6E Module Steps Up When the Airwaves Get Crowded

U-blox built the tri-band Wi-Fi 6E and Bluetooth 5.4 module for secure, high-throughput industrial IoT applications.


News Apr 06, 2026 by Joshua Tidwell
Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi is combining cell-level data tracking with a wireless communication architecture to address traceability requirements and reduce wiring complexity in battery systems.


News Apr 06, 2026 by Shannon Cuthrell
Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.


News Apr 03, 2026 by Luke James
Power Integrations Extends Flyback Topology to 440W With GaN

Power Integrations Extends Flyback Topology to 440W With GaN

At APEC 2026, Power Integrations introduced its TopSwitchGaN 440 W, which unites PowiGaN switches with traditional TOPSwitch architecture, simplifying high-power designs.


News Apr 03, 2026 by Luke James
Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.


News Apr 02, 2026 by Jake Hertz
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.


News Apr 02, 2026 by Gordon Feller
Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

The startup's programmable chip uses a metasurface architecture to control light without moving parts.


News Apr 01, 2026 by Luke James
pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.


News Mar 31, 2026 by Jake Hertz
5 Light-Based Technologies Reshaping Computing and Sensing

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.


News Mar 31, 2026 by Luke James
Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.


News Mar 30, 2026 by Austin Futrell
Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.


News Mar 30, 2026 by Duane Benson