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Pico Technology Claims ‘Industry’s First’ 4 Channel 16-Bit Oscilloscope

Pico Technology Claims ‘Industry’s First’ 4 Channel 16-Bit Oscilloscope

The PicoScope 5000E Series delivers a 22-µV RMS noise floor and up to 5-GS/s sampling in a USB-C-powered package.


News Jul 08, 2026 by Jake Hertz
MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.


News Jul 07, 2026 by Luke James
U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox has introduced the MAYA-W5 and NORA-W5 Wi-Fi 6 module families for industrial and IoT applications, designed and manufactured in Europe.


News Jul 07, 2026 by Joshua Tidwell
Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.


News Jul 06, 2026 by Jake Hertz
The Intel 8051: How a 1980 Microcontroller Lasts the Test of Time

The Intel 8051: How a 1980 Microcontroller Lasts the Test of Time

Intel's 1980 microcontroller put a CPU, memory, timers, and serial I/O on a single chip. It’s an architecture that still ships inside billions of devices.


News Jul 03, 2026 by Luke James
Melexis First to Develop 2-Wire, 2-Bit Hall Switch for Auto Sensing

Melexis First to Develop 2-Wire, 2-Bit Hall Switch for Auto Sensing

The programmable Hall switch can detect up to four positions using a single device.


News Jul 02, 2026 by Joshua Tidwell
Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.


News Jul 01, 2026 by Jake Hertz
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
EPC Debuts Ultra-Compact GaN Motor Drive Reference Design

EPC Debuts Ultra-Compact GaN Motor Drive Reference Design

The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.


News Jun 26, 2026 by Jeff Child
Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

Gigadevice Unveils Pair of MCUs Tailored Specifically for Optical Modules

The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.


News Jun 26, 2026 by Duane Benson
Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.


News Jun 25, 2026 by Luke James
Qorvo Targets 5G Radio Complexity With New Wideband RF Switch Family

Qorvo Targets 5G Radio Complexity With New Wideband RF Switch Family

The family replaces cascaded switch architectures, reducing component count, improving signal integrity, and supporting operation from 50 MHz to 10 GHz.


News Jun 24, 2026 by Austin Futrell
Cirrus Logic Expands Pro Audio Converter Lineup With New 32-Bit Devices

Cirrus Logic Expands Pro Audio Converter Lineup With New 32-Bit Devices

Cirrus Logic introduced nine new 32-bit ADCs, DACs, and codecs for pro and prosumer audio systems with 115 dB dynamic range.


News Jun 23, 2026 by Joshua Tidwell
Tektronix Intros Wideband Shunts and High Voltage Differential Probe

Tektronix Intros Wideband Shunts and High Voltage Differential Probe

The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision low-current analysis to high voltage power validation.


News Jun 23, 2026 by Austin Futrell
3 Pocket-Sized Photonics Innovations Power MedTech to Atomic Clocks

3 Pocket-Sized Photonics Innovations Power MedTech to Atomic Clocks

Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.


News Jun 22, 2026 by Luke James
ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child