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Nearly five decades after Intersil released the ICL7106 and ICL7107 in 1978, the chips at the heart of the world's…

Nearly five decades after Intersil released the ICL7106 and ICL7107 in 1978, the chips at the heart of the world's cheapest digital meters are still in production.

To close out Women's History Month, we spotlight Kristina M. Johnson, the mind behind RealD's 3D technology—just one of…

To close out Women's History Month, we spotlight Kristina M. Johnson, the mind behind RealD's 3D technology—just one of her 118 patents.

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables,…

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.

The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog…

The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.

Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity…

Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.

MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without…

MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without storing cryptographic keys on external servers.

To celebrate Women's History Month, we spotlight Erna Hamburger, an engineer who graduated top of her class at EPFL in…

To celebrate Women's History Month, we spotlight Erna Hamburger, an engineer who graduated top of her class at EPFL in 1933 and spent decades breaking institutional barriers in electrical engineering and measurement science.

Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT)…

Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature that can enable verification of data rates up to 7.5 Mbps.

A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.

A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with…

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.

AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia,…

AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.

Introduced in 1974, the TMS1000 family combined CPU, ROM, RAM, and I/O on a single die and established the commercial…

Introduced in 1974, the TMS1000 family combined CPU, ROM, RAM, and I/O on a single die and established the commercial template for the microcontroller.

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next…

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories,…

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.