Is Two Better Than One? Multi-beam Signals Target 5G Reliability and Throughput
Multipath signals are generally considered an undesirable noise source in RF links. Flipping conventional thinking on its head, UC San Diego Researchers are…
Tessent Silicon Lifecycle Solutions: Enabling the Next Step in IC Test and Monitoring
This paper explains the drivers and benefits of implementing PLM practices into the semiconductor industry. This resource also provides a detailed…
Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications
AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory…
Online DFM Analysis For Better Products and Faster Cloud-Based Tools For Collaboration Between PCB Designers and Manufacturers
This white paper describes Siemens' new cloud-based solution and provides use-case examples. Readers will also get a detailed description and testimonial from…
Wearable Sensors Monitor Biometrics Underwater—and in Deep Tissue
Health wearables are one of the most in-demand consumer electronics. Here's a roundup of a few recent sensor-level innovations.
From Home to the Quantum Realm: 3 Companies Push Processor Limitations
As the need for better, faster, and safer processing continues to grow, companies like Intel, Cadence, and QuantWare are bringing their A-game to the workplace,…
Achronix’s Speedster7t FPGA Launches to the Next Level Thanks to Synopsys’ IP
Designing on silicon is expensive, which is why it's important to get it right on your first pass. Achieving just that is Achronix's Speedster7t FPGA for AI…
IBM’s First CPU With On-chip AI Acceleration Detects Fraud at Lightning Speeds
Containing 22 billion transistors, IBM's new processor, Telum, features on-chip acceleration for AI inferencing. The goal: to detect fraud before a transaction…