STMicro Unwraps Context-Aware Sensors Built With Sustainable Materials
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.
LTCC Solutions for Next Generation
Download LTCC Solutions for Next Generation UWB/BLE Devices to explore how advanced LTCC technology can enable compact, high-performance RF solutions for…
Hubble Raises $200M to Connect Standard Bluetooth Devices by Satellite
The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.
Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers
The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients,…
Summit 2026 - From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure
From Grid to GPU: Validating Next-Gen AI Data Center Power Infrastructure
Summit 2026 - The Evolution of SiC Power Devices: Why Cascode and Dual Drive JFETs Matter
Discover how a new generation of normally-off SiC JFETs is emerging as a compelling alternative to mainstream SiC MOSFETs, driving new levels of efficiency,…
Summit 2026 - Achieving 80 PLUS Certification: Precision Efficiency Testing for Server PSUs
Discover how precision power analyzers enable accurate efficiency measurements for data server power supplies and help meet 80 PLUS certification requirements…
Summit 2026 - The Hidden Tech Powering AI: Advanced Magnetics for Next-Gen Data Centers
As AI power demands grow, advanced magnetics, protection, and power management technologies are enabling more efficient, reliable, and scalable data center architectures.