Recent revisions to the National Electric Code (NEC) will impact surge protection strategies for existing and new designs. We'll explore the latest surge protection technologies and discuss how TDK's solutions align with these updated guidelines.

The semiconductor industry is experiencing the next wave of Silicon Carbide (SiC) performance enabling SiC die to perform at higher levels. In this session, we will provide an overview of the advancements in SiC power packaging.

Join us to demystify the Cyber Resilience Act and NIS2 directive, and discover how IEC-62443 can help you start your journey towards compliance and enhanced cyber security. Don't miss this chance for a clear introduction to EU cyber security regulations.

Learn about the essential role of timing devices in electronics, focusing on their precision, types, and performance requirements. Key topics include quartz crystals, MEMS oscillators, atomic clocks, solutions to design challenges, and future trends.

In environments with strong EMI, digital isolators provide safe, interference-free data transmission by isolating electrical zones. A specific design showcases effective long-distance signal transmission with minimal effort and strong EMI resistance.

Dr. Lidow, a key player in many of the biggest developments in power semiconductors for decades, joins us to discuss the history and future of GaN. At Efficient Power Conversion (EPC), he leads the deployment of GaN technology into power applications.

Do your new designs require higher data rates, higher RF frequencies, smaller sizes, and increased power consumption? Our expert panel will discuss recent connector technology innovations that improve performance, reliability, and manufacturability.

Join us to explore how, from low-cost development boards to seamless software integration, NXP can help accelerate and simplify the different points in your developer journey!